Auburn establishes Electronics Packaging Research Institute
By Jeremy Henderson
Auburn University’s seminal work on semiconductor packaging has new packaging of its own — the Auburn University Electronics Packaging Research Institute (EPRI).
The institute’s recent establishment marks a significant new emphasis on the semiconductor packaging research conducted through Auburn’s Center of Advanced Vehicle and Extreme Environment Electronics, or CAVE3.
The institute was founded in 1999 through funding from the National Science Foundation and support from select companies focusing primarily on automotive electronics.
Pradeep Lall, the John and Anne MacFarlane Endowed Distinguished Professor and Alumni Professor in the Department of Mechanical Engineering, has directed the center since 2008. He will continue to serve as director of EPRI.
“Our need for domestic capability in manufacturing, research and development for semiconductor packaging has really entered the national conversation with the recent establishment of the National Advanced Packaging Manufacturing Program under the Creating Helpful Incentives to Produce Semiconductors Act,” Lall said.
In June 2021, the White House identified four key product areas of vulnerability, with semiconductor manufacturing and advanced packaging topping the list.
The report recognized the role of semiconductor packaging as an important avenue for innovation in the density and size of electronic products; the U.S. global share of semiconductor production has dropped from 37 percent in 1990 to only 12 percent today.
“In this current environment, we’re realizing the criticality of electronics in general and semiconductor packaging in particular for securing the supply chain and enabling advanced system functionality both in the U.S. and Europe,” Lall said.
Under Lall’s leadership, Auburn’s work along these lines has grown exponentially, especially over the past decade.
In 2015, he led the Auburn team, contributing to the winning proposal that resulted in the foundation of the NextFlex National Manufacturing Institute.
Auburn is a tier-1 founding member of NextFlex, whose mission is to advance U.S. manufacturing of flexible hybrid electronics.
Lall serves on the NextFlex technical council and has previously served on the governing council of the institute.
“Growing CAVE3 into the Auburn University Electronics Packaging Research Institute was the logical next step for our activities in this important area of research,” said Mario Eden, dean of engineering. “It’s recognition of its broadened focus, breadth of sponsored research, as well as its international standing.”
