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Electronics Parts, Manufacturing, and Packaging Engineering Graduate Certificate

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US News Badge - Best Grad Engineering 2026
US News Badge - Best Grad Engineering 2026
US Veterans Badge - Best Grad Engineering 2026
12

Credit Hours

PROGRAM COST

$949 Per Credit Hour

10 to 15

Week Terms

SEMESTER BEGINS

Mid August
Early January
Late May


Campus

Complete two core/required courses:

INSY 6850 Electronics Manufacturing Systems

MECH 6310 Mechanics of Electronic Packaging

Complete two elective courses - sample elective courses include:

ELEC 6260 Embedded Computing Systems

ELEC 6730 Microelectronic Fabrication

ELEC 7750 Low Temperature Electronics

INSY 7380 Reliability Engineering

INSY 7730 Product Design, Development, and Test

INSY 7740 Product Launch, Manufacturing, and Delivery

MECH 6210 Electronics Thermal Management

MECH 6610 Mechanical Vibration

MECH 7220 Convection Heat Transfer

Courses delivered by streaming video

Ranked 18th by U.S. News and World Report

40 online graduate degrees and certificates offered

Why this certificate?

The graduate certificate in Electronics Parts, Manufacturing, and Packaging Engineering, offered through collaboration among the mechanical, industrial and systems, and electrical and computer engineering departments, is available online or on campus to both degree and non-degree-seeking students. This certificate will equip students with the knowledge and training that prepares them to succeed as engineers leading, designing, building, and implementing civilian and military technologies for which high reliability electronics are critical elements

Who is eligible?

Those who hold a bachelor's degree in engineering, or a closely related field from an institution of recognized standing are eligible to apply. Exceptions may be approved if the student has the background needed to successfully complete the graduate engineering courses. There is no GRE requirement.

What can you expect?

Students will gain the knowledge and expertise to oversee electronic parts procurement for harsh environment applications, design packaging to protect sensitive electronic systems from the rigors of a harsh environment, conduct engineering assessments of electronic components for reliability-related performance, and develop test plans for electronic parts and systems, including screening and qualification testing.

How do I apply?