Publications

2023 Published Papers

Authors Title Conference Location Date Publisher
Maruf, MA, Mazumder, GR, Chakraborty, S, Suhling, JC, & Lall, P. Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Chakraborty, S, Mondal, D, Mazumder, GR, Maruf, MA, Suhling, JC, & Lall, P. Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Mazumder, GR, Chakraborty, S, Maruf, MA, Suhling, JC, & Lall, P. Incorporation of Damage in Creep Models for SAC305 Lead Free Solder. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Mondal, D, Suhling, JC, Mirkoohi, E, & Lall, P. Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Musa, F, Soni, V, & Miller, S. Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Musa, F, Soni, V, & Miller, S. Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Bimali, S, & Miller, S. Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Bimali, S, Narangaparambil, J, & Miller, S. Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Jang, H, & Miller, S. Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Jang, H, Narangaparambil, J, & Hill, C. Development and Reliability Evaluation of Additively Printed Biosensing Device for Wearable Applications in Harsh Environment. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Pandurangan, ARR, & Choudhury, P. Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, & Kasturi, M. Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, & Kasturi, M. Effect of Thermal Cycling on Interfacial Fracture Toughness of Electronic Mold Compound-to-Substrate Interface Subjected to Monotonic and Fatigue Loading. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Karakitie, D, & Miller, S. Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Karakitie, D, & Miller, S. Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Sarwar, MG, Soni, V, & Miller, S. Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Kulkarni, S, Narangaparambil, J, & Miller, S. Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Tahat, S, Hamasha, S, & Meilunas, M. Drop/Shock Behavior of Low Temperature Solder BGA. SMTA International 2023 Minneapolis, MN, USA October 09–12, 2023 SMTA
Lall, P, Kulkarni, S, Soni, V, & Miller, S. Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Mehta, V, Suhling, J, & Locker, D. Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Mehta, V, Suhling, J, & Blecker, K. High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, & Zhang, Y. Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, & Jung, S. Polarization Curves, Package-Level Multiphysics Simulation of Cu85Al15 and Cu94Al6 WB Corrosion for Automotive and Rugged Environment Applications. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Sarwar, MG, Soni, V, & Miller, S. Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Soni, V, Narangaparambil, J, & Miller, S. Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Pandurangan, ARR, & Blecker, K. Predictive Modeling of High-G Potted Assemblies With Fine Pitch Electronics After Sustained High-Temperature Exposure. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Pandurangan, ARR, & Katsuri, M. Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Kulkarni, S, & Miller, S. Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Saha, M, Suhling, J, & Locker, D. Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Choudhury, P, & Pandurangan, ARR. Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Narangaparambil, J, Soni, V, & Miller, S. Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, & Choudhury, P. Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Soni, V, & Miller, S. Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Soni, V, Kulkarni, S, & Miller, S. Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems San Diego, CA, USA October 24–26, 2023 ASME
Lall, P, Pandurangan, ARR, Choudhury, P, & Kasturi, M. Study of the FCBGA Package Interfaces Reliability Under Monotonic and Fatigue Loads after Sustained High Temperature. SMTA International 2023 Minneapolis, MN, USA October 09–12, 2023 SMTA
Lall, P, Mehta, V, & Saha, M. Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders under Wide Temperature Extremes and Prolonged Exposure to High Temperature. SMTA International 2023 Minneapolis, MN, USA October 09–12, 2023 SMTA

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