Maruf, MA, Mazumder, GR, Chakraborty, S, Suhling, JC, & Lall, P. |
Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Chakraborty, S, Mondal, D, Mazumder, GR, Maruf, MA, Suhling, JC, & Lall, P. |
Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Mazumder, GR, Chakraborty, S, Maruf, MA, Suhling, JC, & Lall, P. |
Incorporation of Damage in Creep Models for SAC305 Lead Free Solder. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Mondal, D, Suhling, JC, Mirkoohi, E, & Lall, P. |
Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Musa, F, Soni, V, & Miller, S. |
Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Musa, F, Soni, V, & Miller, S. |
Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Bimali, S, & Miller, S. |
Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Bimali, S, Narangaparambil, J, & Miller, S. |
Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Jang, H, & Miller, S. |
Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Jang, H, Narangaparambil, J, & Hill, C. |
Development and Reliability Evaluation of Additively Printed Biosensing Device for Wearable Applications in Harsh Environment. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Pandurangan, ARR, & Choudhury, P. |
Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, & Kasturi, M. |
Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, & Kasturi, M. |
Effect of Thermal Cycling on Interfacial Fracture Toughness of Electronic Mold Compound-to-Substrate Interface Subjected to Monotonic and Fatigue Loading. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Karakitie, D, & Miller, S. |
Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Karakitie, D, & Miller, S. |
Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Sarwar, MG, Soni, V, & Miller, S. |
Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Kulkarni, S, Narangaparambil, J, & Miller, S. |
Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Tahat, S, Hamasha, S, & Meilunas, M. |
Drop/Shock Behavior of Low Temperature Solder BGA. |
SMTA International 2023 |
Minneapolis, MN, USA |
October 09–12, 2023 |
SMTA |
Lall, P, Kulkarni, S, Soni, V, & Miller, S. |
Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Mehta, V, Suhling, J, & Locker, D. |
Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Mehta, V, Suhling, J, & Blecker, K. |
High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, & Zhang, Y. |
Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, & Jung, S. |
Polarization Curves, Package-Level Multiphysics Simulation of Cu85Al15 and Cu94Al6 WB Corrosion for Automotive and Rugged Environment Applications. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Sarwar, MG, Soni, V, & Miller, S. |
Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Soni, V, Narangaparambil, J, & Miller, S. |
Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Pandurangan, ARR, & Blecker, K. |
Predictive Modeling of High-G Potted Assemblies With Fine Pitch Electronics After Sustained High-Temperature Exposure. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Pandurangan, ARR, & Katsuri, M. |
Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Kulkarni, S, & Miller, S. |
Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Saha, M, Suhling, J, & Locker, D. |
Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Choudhury, P, & Pandurangan, ARR. |
Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Narangaparambil, J, Soni, V, & Miller, S. |
Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, & Choudhury, P. |
Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Soni, V, & Miller, S. |
Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Soni, V, Kulkarni, S, & Miller, S. |
Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform. |
ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
San Diego, CA, USA |
October 24–26, 2023 |
ASME |
Lall, P, Pandurangan, ARR, Choudhury, P, & Kasturi, M. |
Study of the FCBGA Package Interfaces Reliability Under Monotonic and Fatigue Loads after Sustained High Temperature. |
SMTA International 2023 |
Minneapolis, MN, USA |
October 09–12, 2023 |
SMTA |
Lall, P, Mehta, V, & Saha, M. |
Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders under Wide Temperature Extremes and Prolonged Exposure to High Temperature. |
SMTA International 2023 |
Minneapolis, MN, USA |
October 09–12, 2023 |
SMTA |