Books and Book Chapters

• Arık, A. Kosar, H. Bostancı, A. Bar-Cohen, “Pool Boiling Critical Heat Flux in Dielectric Liquids and Nanofluids”, Advances in Heat Transfer, Ed. Young Cho and George Greene, Vol. 43, pp. 1-76, ISBN: 9780123815309, 2011.
• Arik, A. Setlur, S. Weaver and J Shiang, “Energy Efficient Solid State Lighting Systems”, Encyclopedia of Thermal Packaging, World Scientific Publishing, 168pp, Ed. A. Bar-Cohen, Vol. 5, 2013.
• Han, B. Song and M. Arik, “Solid State Lighting Reliability - Hierarchical Reliability Assessment Models for Novel LED-Based Recessed Down Lighting Systems”, Springer New York, Vol. 1, Chp. 18, Pages 455-495, Ed.  van Driel, W.D., Fan, X.J., ISBN 978-1-4614-3067-4, 2012.
• Arik and Y. Utturkar, “Synthetic Jets for Heat Transfer Augmentation”, Synthetic Jets: Fundamentals and Applications, CRC Press, Ed. Kamran Mohseni, Rajat Mittal, 382pp, ISBN:9781439868102, November 2014.
• Arik and E. Tamdogan, “Synthetic Jets Heat Transfer Augmentation for Microelectronics Systems”, Cooling of Microelectronics Book, World Scientific Publishing, Ed. M. Iyengar, K. J. Geisler, B. Sammakia, ISBN: 978-981-4579-78-0, October 2014.

Journal Publications

• Saygin, A. M. Basol and M. Arik, “An Experimental Study on the Frost Formation over a Flat Plate: Effect of Frosting on Heat Transfer”, Experimental Thermal and Fluid Science, January 2023.
• Azarifar, M. Arik, Bin Xie, and X. Luo, “Effect of Phase Change Materials on the Optical Path of LEDs for Opto-Thermal Enhancement”, IEEE Journal of Electron Devices, accepted for publication, March 2023.
• Cengiz, A. M. Muslu, M. Azarifar, M. Arik, and B. Dogruoz, "Discrete Phase Analysis of Self Heating Particles Over An Immersion Liquid Cooled High Power Blue LED with Suspended Phosphor Particles," ASME Journal of Heat Transfer, June 2022.
• Azarifar, K. Ocaksonmez, C. Cengiz, R. Aydoğan, and M. Arik, “Machine Learning to Predict Junction Temperature Based on Optical Characteristics in Solid State Lighting Devices: A Test on WLEDs”, Micromachines, July 2022.
• Cengiz, M. Azarifar and M. Arik, "A Critical Review on the Junction Temperature Measurement of Light Emitting Diodes", Micromachines, April 2022.
• Azarifar, C. Cengiz and M.Arik, “Dynamic opto-electro-thermal characterization of solid state lighting devices: measuring the power conversion efficiency at high current densities”, Journal of Physics D: Applied Physics, June 2022.
• Azarifar, C. Cengiz, and M. Arik, “Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling”, Int. J. Heat Mass Transfer, Vol. 189, p. 122607, 2022.
• Emir, H. Ourabi, M. Budakli, and M. Arik, “Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review”, ASME Journal of Electronics Packaging, April 2022.
• Azarifar, C. Cengiz, and M. Arik, “Optical and Thermal Analysis of Secondary Optics in Light Emitting Diodes’ Packaging: Analysis of MR16 Lamp”, Journal of Physics: Conference Series, September 2021.
• Ikhlaq, M. Yasir, O. Ghaffari, and M. Arik, “Acoustics and heat transfer characteristics of piezoelectric driven central orifice synthetic jet actuators”, Experimental Heat Transfer, 2022.
• Azarifar, C. Cengiz, and M. Arik, “A Roadmap for Dynamic Temperature Sensitivity Measurement of Solid State Lighting Devices: A Thermal Perspective on the Power Conversion Efficiency of Blue LEDs and Lasers” Journal of Physics, under review, February 2022.
• Azarifar, M. Budakli, A. M. Basol, and M. Arik, “On the Individual Droplet Growth Modeling and Heat Transfer Analysis in Dropwise Condensation for Advanced Heat Spreaders”, IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2021.
• Azarifar, C. Cengiz, and M. Arik, “Package Level Thermal Analysis of White Light-emitting Diodes Based on Local Phosphor Particle Opto-thermal Behavior,” LED professional Review (LpR), no. 85/May-June, pp. 60–65, 2021.
• Ikhlaq, M. Yasir, M. Demiroglu, and M. Arik, “Impingement Heat Transfer Characteristics of Recent Developments in Synthetic Jet Cooling Technology for Electronics Thermal Management”, IEEE Trans. CPMT, June 2021.
• Azarifar, C. Cengiz, and M. Arik, “Particle Based Investigation of Self-Heating Effect of Phosphor in Phosphor Converted Light Emitting Diodes”, Journal of Luminescence, Vol. 231, March 2021.
• Cetiner, B. Evren, M. Budakli, A. Ozbek, and M. Arik, "Spreading Behavior of Droplets Impacting over Substrates with Varying Surface Topographies", Colloids and Surfaces A: Physicochemical and Engineering Aspects, December 2020.
• Budakli, T. K. Salem, M. Arik, B. Donmez, and Y. Menceloglu, “An Experimental Study on the Heat Transfer and Wettability Characteristics of Micro-structured Surfaces During Water Vapor Condensation Under Different Pressure Conditions”, Int. Communications in Heat and Mass Transfer, January 2021.
• Budaklı, T. K. Salem, M. Arik, B. Donmez, Y. Menceloglu, “Effect of Polymer Coating on Condensation Heat Transfer”, ASME Journal of Heat Transfer, 142(4): 041602, April 2020.
• Ikhlaq, M. Yasir, O. Ghaffari, and M. Arik, “Acoustics and Heat Transfer Characteristics of Piezoelectric Driven Central Orifice Synthetic Jet Actuators”, Experimental Heat Transfer, June 2021.
• Ikhlaq, M. Arik, A. Arshad, M. Jabbal, “Flow and Heat Transfer Characteristics of Piezoelectric-Driven Synthetic Jet Actuator with Respect to Their Stroke Length”, Advances in Heat Transfer and Thermal Engineering, pp 659-662, June 2021.
• Yildirim, P. Sendur, A. Kansizoglu, U. Uras, O. Bilgin, G. Yapici, M. Arik, and B. Ugurlu, “Design and Development of a Durable Series Elastic Actuator with an Optimized Spring Topology”, Proc. of the iMeche, Part C: Journal of Mechanical Engineering Science, June 2021.
• Budakli, T. K. Salem, and M. Arik, “An Experimental and Theoretical Analysis of Vapor-to-Liquid Phase Change on Micro-Structured Surfaces”, Applied Thermal Engineering, May 2020.
• M. Muslu, B. Ozluk, and M. Arik, "A Comparative Study on the Impact of Junction Temperature over Thermal, Optical and Electrical Traits of High Power Red Light Emitting Diodes (LEDs)", ASME Journal of Electronics Packaging (JEP), EP-19-1020, May 2020.
• Ozluk, A. M. Muslu, and M. Arik, "A Comparative Study for the Junction Temperature of Green Light Emitting Diodes (LED)s", IEEE Transactions on Components, Packaging and Manufacturing Technology, TCPMT-2018-405, July 2019.
• K. Salem, M. Budaklı, O. Sahan and M. Arik, “An Experimental and Analytical Study on the Influence of Superhydrophobic Micro-Textured Surfaces on Liquid Wetting Phenomena”, Colloids and Surfaces A: Physicochemical and Engineering Aspects, Vol. 555, October 2018.
• K. Salem, I. T. Nazzal, M. Arik and M. Budakli, “Impact of Functional Nanofluid Coolant on Radiator Performance”, ASME Journal of Thermal Science and Engineering Applications, Vol. 11, Issue 4, DOI: 10.1115/1.4044271, July 2019.
• Khosroshahi and M. Arik, “Conduction Driven Cooling of LED Based Automotive LED Lighting Systems for Abating Local Hot Spots”, Optical Engineering, March 2018.
• I. Kahvecioglu, E. Tamdogan and M. Arik, “Investigation of Combined Optical and Thermal Effects on Phosphor Converted Light Emitting Diodes with Liquid Immersion Cooling”, SPIE Optical Engineering , May 2018.
• Tamdogan, G. Pavlidis, S. Graham, and M. Arik, “A Comparative Study on the Junction Temperature Measurements of LEDs with Raman Spectroscopy, Micro-Infrared (IR) Imaging and Forward Voltage Methods”, ASME Journal of Electronic Packaging, February 2018.
• Uras and M. Arik, “Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL”, LED Professional Review, 64, pp. 44-51, December 2017.
• K. Salem, F. Khosroshahi, M. Arik, M. Hamdan, and M. Budakli, “Numerical and Experimental Analysis of a Heat Pipe Embedded Printed Circuit Board for Solid State Lighting Applications”, Experimental Heat Transfer, pages 1-13, November 2017.
• Z. Uras, M. Arık and E. Tamdoğan, “Thermal Performance of a Light Emitting Diode Light Engine for A Multipurpose Automotive Exterior Lighting System With Competing Board Technologies”, ASME Journal of Electronic Packaging, June 2017.
• U. Yuruker, E. Tamdogan, and M. Arik, “An Experimental and Computational Study on Efficiency of White LED Packages with a Thermo-caloric Approach”,  IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 7, Issue: 2, Feb. 2017.
• A. Solovitz, O. Ghaffari, and M. Arik, “Frequency-dependent flow response of a high-speed rectangular synthetic jet”, Journal of Flow Visualization and Image Processing, Vol. 23, issue 1-2, January 2016.
• Ghaffari, S.A. Solovitz, M. Ikhlaq, and M. Arik, “An Investigation into Flow and Heat Transfer of an Ultrasonic Micro-blower Device for Electronics Cooling Applications” Journal of Applied Thermal Engineering, 106 (2016) 881–889, June 2016.
• Ghaffari, S.A. Solovitz, and M. Arik, “An Investigation into Flow and Heat Transfer for a Slot Impinging Synthetic Jet” Int. Journal of Heat and Mass Transfer, 100 (2016) 634–645, June 2016.
• Ikhlaq, O. Ghaffari and M. Arik, “Predicting heat transfer for low and high frequency central orifice synthetic jets”, IEEE Transactions on Components and Packaging Technologies, pp.882-888, 27-30 May 2016.
• Arik and Y. Utturkar, “A computational and experimental investigation of synthetic jets for cooling of electronics”, ASME Journal of Electronic Packaging, Vol. 137, Issue. 2, June 2015.
• He, J. Lustbader, M. Arik, and R. Sharma, “Heat transfer characteristics of impinging steady and synthetic jets over vertical flat surface”, International Journal of Heat and Mass Transfer, Vol. 80, pp. 825-834, Jan. 2015.
• Ghaffari, M. Ikhlaq, and M. Arik, “Heat Transfer performance of Semi confined circular and unconfined Slot impinging synthetic jet piezoelectric actuator for small jet to surface spacing”, International Journal of Air-Conditioning and Refrigeration, Vol. 23, Issue 03, April 2014.
• Tamdogan and M. Arik, “Natural convection immersion cooling and optical degradation of liquid cooled LED systems”, ASME Journal of Electronics Packaging, Vol. 137, Issue 4, October 2015.
• Ri Li, William D. Gerstler, M. Arik, and Benjamin Vanderploeg, “An experimental and theoretical study for impact of synthetic jets for air-cooled arrays of fins”, Journal of Heat Transfer-Transactions of the ASME, Vol. 138, Issue 2, October 2015.
• N. Inan and M. Arik, “A multi-functional-design approach and of figure of merits for LED lighting systems”, Journal of Solid State Lighting, Vol.1, Issue.8, 27 May 2014.
• Arik, R. Sharma, J. Lustbader, X. He, “Steady and unsteady air impingement heat transfer for electronics cooling applications”, Journal of Heat Transfer-Transactions of the ASME, Vol. 135, Issue. 11, 23 September 2013.
• Arik and T. Icoz, “Predicting heat transfer from unsteady synthetic jets”, Journal of Heat Transfer-Transactions of the ASME, Vol. 134, Issue. 8, 31 May 2012.
• Solovitz and M. Arik, “System-level metrics for thermal management technology”, Journal of Thermal Science, Vol. 3, Issue.3, 12 August 2011.
• Seeley, Y. Utturkar, M. Arik, and T. Icoz, “Fluid structure interaction model for low frequency synthetic jets”, AIAA Journal, Vol. 49, Issue. 2, pp. 316-323, February 2011.
• Arik, J. Jackson, S. Prabhakaran, C. Seeley, R. Sharma, Y. Utturkar, S. Weaver, G. Kuenzler, and B. Han, “Development of a high lumen solid state down light application”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 4, pp. 668-679, 22 November 2010.
• Song, B. Han, A. Bar-Cohen, R. Sharma, and M. Arik, “Hierarchical life prediction model for actively cooled LED-based luminaire”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 4, pp. 728-737, 16 August 2010.
• Arik and A. Bar-Cohen, “Pool boiling of perfluorocarbon mixtures on silicon surfaces”, International Journal of Heat and Mass Transfer, Vol. 53, Issues 23-24, pp. 5596-5604, November 2010.
• B. Dogruoz, and M. Arik, “On the conduction and convection heat transfer from lightweight advanced heat sinks”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 2, pp. 424-431, 26 April 2010.
• Icoz, and M. Arik, “Light weight high performance thermal management with advanced heat sinks and extended surfaces”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 1, pp. 161-166, 13 October 2009.
• Petroski, M. Arik and M. Gursoy, “Optimization of piezoelectric oscillating fan cooled heat sinks for electronics cooling applications”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 1, pp. 25-31, 13 October 2009.
• Arik, J. Bray, and S. Weaver, “Solid State Thermotunneling systems for power generation”, Nanoscience and Nanotechnology Letters, Vol. 2, N0.2, pp. 63-195, June 2010.
• Arik and A. Setlur, “Environmental and economical impact of LED lighting systems and effect of thermal management”, International Journal of Energy Research, Vol. 34, Issue. 13, pp. 1195-1204, 25 October 2010.
• Arik, “Local heat transfer coefficients of a high frequency synthetic jets during impingement cooling over flat surfaces”, Heat Transfer Engineering, Vol. 29, Issue. 9, 2008.
• Utturkar, M. Arik, C.E. Seeley, and M. Gursoy, “An experimental and computational heat transfer study of pulsating jets”, Journal of Heat Transfer-Transactions of the ASME, Vol. 130, Issue. 6, 23 April 2008.
• Arik, “An investigation into feasibility of impingement heat transfer and acoustic abatement of meso scale synthetic jets”, Applied Thermal Engineering, Vol. 27, Issue. 8-9, Pages 1483-1494, June 2007.
• Arik, S. Weaver, A. Setlur, D. Haitko, and J. Petroski, “Chip to system levels thermal needs and alternative thermal technologies for high brightness LEDS”, Journal of Electronic Packaging, Vol. 129, Pages 328-338, 9 April 2007.
• Arik, A. Bar-Cohen, and S.M. You, “Enhancement of pool boiling critical heat flux in dielectric liquids by micro porous coatings”, International Journal of Heat and Mass Transfer, Vol. 50, pp. 997-1009, March 2007.
• Bar-Cohen, M. Arik, and M. Ohadi, “Direct liquid cooling of high flux micro and nano electronic components”, Proceedings of the IEEE, Vol. 94, Issue. 8, pp. 1549-1570, August 2006.
• Arik and S. Weaver, “Effect of chip and bonding defects on the high brightness LED junction temperatures”, Optical Engineering, Vol. 44, Issue. 11, November 2005.
• Arik and R.S. Bunker, “Electronics packaging cooling: Technologies from gas turbine engine cooling”, Journal of Electronic Packaging, Vol. 128, Issue. 3, pp. 215-225, 16 June 2005.
• Garg, M. Arik, S. Weaver, T. Wetzel, and S. Saddoughi, “Advanced localized air cooling with synthetic jets”, ASME Journal of Electronics Packaging, Vol. 127, pp.503-511, 2005.
• Arik, S.M. Zurn, and A. Bar-Cohen, “Design and fabrication of MEMS micropumps for high heat flux electronics cooling applications”, Smart Materials and Structures, Vol. 14, pp. 1239-1249, 2005.
• Arik, J. Garg, and A. Bar-Cohen, “Thermal modeling and performance of high heat flux for SOP packages”, IEEE Transactions on Advanced Packaging, Vol. 27, Issue. 2, pp. 398-412, May 2004.
• Arik, and A, Bar-Cohen, “Effusivity-based correlation of surface property effects in pool boiling CHF of dielectric liquids”, International Journal of Heat and Mass Transfer, Vol. 46, Issue. 20, pp. 3755-3764, September 2003.
• M. Zurn, M.T. Hsieh, G. Smith, D. Markus, G. Hughes, Y. Nam, M. Arik, and D.L. Polla, “Design and structural characterization of a resonant frequency PZT micro-cantilever”, Smart Materials and Structures, Vol. 10, No. 2, April 2001.
• Arik, C.A.C. Santos, S. Kakac, “Turbulent forced convection with sinusoidal variation of inlet temperature between two parallel-plates”, International Communications in Heat and Mass Transfer, Vol. 23, Issue. 8, Pages 1121-1132, December 1996.

Conference Proceedings 

• Saygin, A. M. Basol, and M. Arik, “An Experimental Study Over Frost Formation: Transient Heat Transfer Analysis via Dimensionless Numbers”, 8^th Thermal and Fluids Engineering Conference (TFEC), College Park, MD, March 2023.
• Emir, M. Budakli, M. Paul, M. Arik, and N. Shamsaei, “EFFECT OF ADDITIVE MANUFACTURED MICROCHANNELS OVER POOL HEAT TRANSFER IN A DIELECTRIC LIQUID”, Pro. of the 17^th International Heat Transfer Conference, IHTC-17, August 2023, Cape Town, South Africa.
• Azarifar and M. Arik, “Direct Numerical Simulation of Synthetic Jet Coupled to Forced Convection Cooling in a Channel Flow”, IEEE Itherm Conference, Orlando, FL, May 2023.
• Budakli and M. Arik, “Saturated and Superheated Water Vapor Condensation on a Custom Micro-Textured Surface”, IEEE Itherm Conference, Orlando, FL, May 2023.
• Emir, M. Budaklı and M. Arik, “M. Budakli and M. Arik, “Impact of Oxidation on Pool Boiling Heat Transfer Performance over Flat Plates Exposed to Extended Operating Conditions”, IEEE Itherm Conference, Orlando, FL, May 2023.
• Azarifar, C. Cengiz, K. Ocaksonmez, A. Onal, S. Nizamoglu, and M. Arik, “High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering”, ASME Interpack, Los Angeles, October 2022.
• Emir, Y. G. Yazici, M. Budakli, and M. Arik, “Pool boiling heat transfer in dielectric fluids and impact of surfaces on the repeatability”, ASME Interpack Conference, October 2022.
• Saygin, E.A. Oksuz, A. M. Basol, and M. Arik, “Analysis of Frost Formation Under Natural Convection Conditions over a Vertical Plate”, International Mechanical Engineering Congress & Exposition (SHTC), June 2022, Philadelphia, USA.
• Saygin, C. Topal, A. M. Basol, M. Arik “Influence of Frost Formation on Heat Transfer Effectiveness of Extended Surfaces”, Proceedings of CONV-22: Int. Symp. on Convective Heat and Mass Transfer, Izmir, Turkey, June 5-10, 2022.
• Emir, M. Budakli, and M. Arik, “Effect of Subcooling and Pressure over Nucleate Pool Boiling on Micro-drilled Surfaces”, Proceedings of CONV-22: Int. Symp. on Convective Heat and Mass Transfer, Izmir, Turkey, June 5-10, 2022.
• Azarifar, and M. Arik, “Heat and Mass Transfer Analysis of Individual Droplet on Superhydrophobic Surface and Surrounding Vapor During Dropwise Condensation”, ATE-HEFAT, July 2021.
• Cengiz, M.Azarifar, and M. Arik, " Thermal and Optical Characterization of White and Blue Multi-Chip LED Light Engines”, 20^th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 2021.
• Azarifar, C. Cengiz, and M. Arik, “Optical and Thermal Analysis of Secondary Optics in Light Emitting Diode’s Packaging: Analysis of MR16 Lamp”, 2021 8th European Thermal Sciences Conference (EUROTHERM), September 2021, Lisbon, Portugal.
• Saygin, E. A. Oksuz, A. M. Basol, and M. Arik, “A Numerical Investigation into Frost Formation under Impinging Flow Conditions”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2021.
• A. Oksuz and M. Arik, “Investigation of frost formation during impinging air flow on finned aluminium substrates”, TIBTD ULIBTK2021 Conference, September 2021, Gaziantep, Turkey.
• Saygin, E. A. Oksuz, A. M. Basol, and M. Arik, "Analysis of Frost Formation Under Natural Convection Conditions over a Vertical Plate", International Mechanical Engineering Congress & Exposition (IMECE), November 2021. 
• Cengiz, A. Muslu, M. Arik, and B. Dogruoz, "Enhanced Thermal Performance of High Flux LED Systems with Two-Phase Immersion Cooling", Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), 19^th IEEE Intersociety Conference, June 2020.
• A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, and M. Arik, An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow”, ASME Interpack Conference, October 2020, San Francisco, USA.
• Tarcin, A. Saygin, M. Muslu, M. Busakli, and M. Arik, “Rapid Heating And Cooling Chamber for a Photonics Junction Measurement System”, 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Itherm, July 2020.
• Muslu, and M. Arik, “Challenges for Measuring Multichip LED Light Engines for Interior Lighting Applications”, Lighting Professional Symposium (LPS) 2019, Bregenz, September 23-27, 2019.
• Muslu, and M. Arik, “Measuring Junction Temperature of LEDs:
  Challenges and Opportunities”, ASME Interpack Conference, October 7-9, 2019.
• Muslu, and M. Arik, “Impact of Electronics over Localized Hot Spots over Multi-Chip White LED Light Engines”, IEEE Itherm Conference 2019, June 2019.
• Cetiner, B. Evren, M. Budaklı, A. Özbek. And M. Arik, “An Investigation Into Wetting Dynamics of a Single Droplet Over a Chilled Solid Surface”, ULIBTK Conference, September 11-14, 2019, Kocaeli, Turkey.
• Budakli, T. K. Salem, and M. Arik, “Micro-structured Surfaces in Condensation: Experimental Approach and Heat Transfer Analysis”, 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Wicklow-Ireland, July 2019.
• Gulduren, V. C., A. Muslu, and M. Arik, “An İnvestigation into Phase Change Materials for Thermal Management and Efficiency Improvement of Photovoltaic Power Harvesting Systems”, 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Wicklow-Ireland (HEFAT 2019), July 2019.
• Isil, M. B. Dogruoz, and M. Arik, “An Investigation of Synthetic Jets Performance Emanating from Circular, Elliptical and Rectangular Nozzles”, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.
• Elibol, M. C. Ozaydın and M. Arik, “Development of a Computational Modeling and Experimental Validation Approach for KSF LED Packages in a 65” Ultra-Thin LED TV System”, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.
• Isıl, B. Yucesan and M. Arik, “Impact of Orifice Size over Mechanical, Flow and Thermal Performances of Synthetic Jets”, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.
• Z. Naseem, P. Sendur, and M. Arik, “Impact of Orifice Location on the Mechanical Response of Side and Central Orifice Synthetic Jets, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.
• Budakli, T. K. Salem, and M. Arik, “Experimental Investigation on Heat Transfer and Surface Wetting Phenomena During Vapor Condensation on Nano Textured Surfaces, 10th International Conference on Boiling and Condensation Heat Transfer, Nagasaki, Japan, 2018.
• Budakli, T. K. Salem, and M. Arik, “Effect of Micro-Structured Surfaces on Heat Transfer and Surface Wetting Phenomenon During Vapor Condensation”, 21th National Conference of Heat Science and Technology (ULIBTK'17), CORUM, Turkey, September 13-16, 2017.
• B. Dogruoz, M. Arik, S. H. Parsa “An experimental and computational study for thermal and thermodynamics performances of a thin piezofan cooler”, IEEE Itherm Conference 2017, June 2017.
• Muslu, B. Ozluk, E. Tamdogan, and M. Arik, “Impact of Junction Temperature over Forward Voltage Drop for Red, Blue, and Green High Power Light Emitting Diode Chips”, IEEE Itherm Conference 2017, June 2017.
• C. Ozaydin and M. Arik, “Controlled Thermal Design of SLIM LED TV Systems”, IEEE Itherm Conference 2017, June 2017.
• Waheed, M.B. Dogruoz, and M. Arik, “Acoustic Analysis of an Axial Fan”, IEEE Itherm Conference 2017, June 2017.
• Z. Uras, and M. Arik, “Thermal and Optical Challenges in Multi Purpose Automotive Exterior Lighting Systems”, Lighting Professional Symposium, LPs-2016, Bregenz, Austria, November 2016.
• Z. Uras, E. Tamdogan, and M. Arik, “Thermal Enhancement of an LED Light Engine for Automotive Exterior Lighting with Advanced Heat Spreader Technology”, ASME IMECE 2016, IMECE2016-65602, Phoenix, AZ, November 2016.
• M. Hashim, Y. Yasa, M. B. Dogruoz, M. Arik, and E. Mese, “Investigation of power distribution on an axial fan”, IEEE Itherm 2016, Las Vegas, June 2016.
• H. Parsa, O. Ghaffari, S. A. Solovitz, M. Arik, “Flow and Heat Transfer Study of an Impinging Piezoelectric Fan over a Vertical Surface”, ASME Summer Heat Transfer Conference, Washington DC, July 2016.
• Ikhlaq, B. Dogruoz, O. Ghaffari, and M. Arik, “Effect of jet to surface spacing on heat transfer mechanism of round synthetic impinging jet” ASME Interpack 2015, San Francisco, USA, July 2015.
• U. Yuruker, M. Arik, E. Tamdogan, R. Melikov, S. Nizamoglu, and I. Durak, “Thermal and optical performance of eco-friendly silk fibroin proteins as a cavity encapsulation over LED systems”, ASME Interpack 2015, San Francisco, USA, July 2015.
• M. Hashim, B. Dogruoz, M. Arik, M. Parlak, “An investigation into performance characteristics of an axial flow fan using CFD for electronic devices”, ASME Interpack 2015 San Francisco, USA, July 2015.
• Apaydin, G. Subasi, E. Tamdogan, and M. Arik, “An investigation into thermal management of LED based street lighting systems”, LPs2015 Lighting Professional Symposium, Bregenz, Austria, September 2015.
• U. Yuruker, E. Tamdogan, and M. Arik, “An experimental and computational study on efficiency of white LED packages with a thermo-caloric approach”, LPs2015 Lighting Professional Symposium, Bregenz, Austria, September 2015.
• S. Khosroshahi, T. Salem, M. Arık and M. O. Hamdan, “Numerical and experimental Analysis of a heat pipe embedded printed circuit board for solid state lighting applications”, IX Minsk International Seminar -Heat Pipes, Heat Pumps, Refrigerators, Power Sources, Minsk, Belarus, September 2015.
• Ghaffari, B. Dogrouz, M. Arik, “An investigation into momentum and temperature fields of a meso-scale slot synthetic jet for a small jet-to-surface spacing”, IHTC 2014 Conference, Kyoto, Japan, August 10- 15, 2014.
• Tamdogan, and M. Arik, ‘Effect of direct liquid cooling on the light emitting diode local hot spots – A Computational and Experimental Study’’, The 15th International Heat Transfer Conference, IHTC 2013, Japan, August 10-15, 2014.
• Tamdogan, and M. Arik, “Effect of liquid cooling on the performance of optical light extraction for LED systems”, 14th İnternational Symposium on the Science and Technology of Lighting– LS14, Como, Italy, June 2014.
• Ghaffari, B. Dogrouz, M. Arik, “An investigation into momentum and temperature fields of a meso-scale synthetic jet ”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.
• Ikhlaq, O.Ghaffari and M. Arik, “Effect of actuator deflection on heat transfer for low and high frequency synthetic jets”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.
• Arik, K. Kulkarni, C. Royce, and S. Weaver, “Developing a standard measurement and calculation procedure for high brightness LED junction temperature”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.
• S. Khosroshahi, M. Arik, C. S. Tufekci, "A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications”, ITHERM 2014, Orlando, June 2014.
• N. Inan and M. Arik, “Development of figure of merits for energy efficient LED lighting systems”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.
• Yang, M. Arik, J. Xu, and A. Bar-Cohen, “Pool boiling and critical heat flux of perfluorocarbon mixtures”, Int. Sym. on Convective Heat and Mass Transfer, Kusadasi, Turkey, June 8 – 13, 2014.
• Tamdogan, and M. Arik, “Numerical investigation of direct liquid cooling and development of new liquids for high brightness light emitting diodes (LEDs)’’Convective Heat and Mass Transfer, CONV-14, Kusadasi, Turkey, June 8-13, 2014.
• Karsli, and M. Arik, “Effect of optical design on the thermal management for the smart TV LED backlight systems”, IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27- May 30, 2014.
• Tamdogan and M. Arik, "Understanding direct liquid cooling of high brightness light emitting diodes (LEDs) in natural convection heat transfer", ASME 2013 International Mechanical Congress & Exposition, IMECE2013, San Diego, CA, November 13-21, 2013.
• Ghaffari, M. B. Dogruoz and M. Arik, “A numerical study of single unsteady laminar slot Jet in a confined structure”, ASME Summer Heat Transfer Conference, Minneapolis, MN, July 15-20, 2013.
• Tamdogan, M. Arik and M. B. Dogruoz, “Direct liquid cooling of high flux led systems: hot spot abatement”, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, San Francisco, CA, July 16-18, 2013.
• Arik, R. Sharma, J. Lustbader, and X. He, “Comparison of synthetic and steady air jets for impingement heat transfer over vertical surfaces”, IEEE Itherm 2012, San Diego, CA, May 28- June 1, 2012.
• He, J. Lustbader, M. Arik, R. Sharma, “Heat transfer characteristics of impinging steady and synthetic jets over vertical flat surface” IEEE Itherm 2012, San Diego, CA, May 28- June 1, 2012.
• Arık, “An investigation into parametric effects on boiling heat transfer”, 9th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics”, HEFAT2012, Malta, 16 – 18 July 2012.
• B. Doğruoz and M. Arik, “Synthetic jets for electronics cooling applications”, HEFAT2012, Malta, 16 – 18 July 2012.
• Solovitz and M. Arik, “System-level metrics for thermal management technology” IEEE ITHERM 2010, Las Vegas, June 2010.
• Li and M. Arik, “Experimental study on convection heat transfer of a single fin duct with pulsed airflow”, Thermal Issues in Emerging Technologies, ThETA 3, Cairo, Egypt, Dec 19-22, 2010.
• Arik, S. Weaver, and J. Bray, “Nano thermotunneling systems for efficient power generation”, SPIE 2010 Micro/Nano Power Generation Systems Conference, Orlando, FL, April 2010.
• Baris Dogruoz, M. Arik, and Adam Pautsch, “Heat transfer in micro channels: substrate effects and cooling efficiency for rectangular and circular ducts”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.
• Arik, Y. Utturkar, and S. Weaver, “Immersion cooling of light emitting diodes”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.
• Arik, Y. Utturkar, “Vortex dynamics of synthetic jets: A computational and experimental investigation”, Int. Heat Transfer Conference 2010, IHTC14-23099, Washington DC, August 2010.
• Arik, R. Li, K. Andreini, J. Crosby, D. Shaddock, “Development of a measurement technique for highly conductive CVD diamonds and analysis of uncertainties due to 3D heat losses”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.
• A. Solovitz and M. Arik, “Understanding the performance metrics for advanced cooling methodologies”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.
• Li, W. D. Gerstler, M. Arik, B. Vanderplog, “Enhancement of natural convection using synthetic jets”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.
• Salapakkam, R. Li, M. Arik, B. Gerstler, “Augmenting forced convection heat transfer coupled with an aerodynamic surface and a synthetic jet”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.
• Francoeur, M. Arik, and M.P. Mengüc,“ Estimating near-field thermal radiation between two flat silicon wafers with surface roughness”, Int. Conference on Nano-materials and Nano-systems, Istanbul, Turkey, June 2009.
• Arik, S. Weaver, and J. Bray, “Thermotunneling systems for advanced efficient cooling”, ASME Interpack Conference, IPACK 89109, San Francisco, July 19-23, 2009.
• Arik and M. S. Ulcay, “Sweeping flow heat transfer with piezoelectric fans over vertical flat surfaces”, ASME Summer Heat Transfer Conference, HT2009-88337, San Francisco, July 19-23, 2009.
• Gottapo, A. Rao, Y. Utturkar, and M. Arik, “Reduced-order investigation of synthetic jet cooling for electronics applications”, HT2009-88608, San Francisco, July 19-23, 2009.
• Utturkar, M. Arik, and T. Icoz, “Thermal characteristics of a synthetic jet integrated heat sink design for air-cooled electronics”, ASME Interpack Conference, IPACK 89109, San Francisco, July 19-23, 2009.
• Arik, Y. Utturkar, and M. Ozmusul, “Effect of synthetic jets over a natural convection heat sink”, ASME International Mechanical Engineering Congress and Exposition, IMECE2008-68784, Boston, MA, October 31- November 6, 2008.
• B. Dogruoz and M. Arik, “An investigation onto the conduction and convection heat transfer from advanced heat sinks”, ITHERM 2008, Orlando, FL, May 28-31, 2008.
• Arik and Y. Utturkar, “Interaction of a synthetic jet with an actively cooled heat sink, ITHERM 2008, Orlando, FL, May 28-31, 2008.
• Royce, M. Arik, S. Weaver, J. W. Bray, V. Ovsyuk, A. Klimenko and A. Yarts, “Thermal conductivity measurements of Si-SiO2-Si sandwich structures for Micro/Nano electronics”, ASME/JSME Thermal Engineering and Summer Heat Transfer Conference 2008, HT-2008-56001, Jacksonville, FL, August 10-14, 2008.
• Petroski, M. Arik and M. Gursoy, “Piezoelectric fans: Heat transfer enhancements or electronics cooling”, ASME-JSME Thermal Engineering and Summer Heat Transfer Conference 2008, HT-2008-56405, Jacksonville, FL, August 10-14, 2008.
• Arik and A. Setlur, “Energy efficient solid state lighting and thermal management for a sustainable future”, Global Conference on Global Warming (GCGW-08), Istanbul, Turkey, July 6-10, 2008.
• E. Seeley, Y. Utturkar, and M. Arik, "Coupled structural and fluid dynamics modeling of a synthetic jet", 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics & Materials Conference, Chicago, IL, March, 2008
• Icoz, M. Arik, R. Marchiando, X. Liu, and Z.H. Lu, “Advanced TPG thermal pyrolytic graphite for the thermal management of electronics” IMAPS 2006 Advanced Technology Workshop on Thermal Management, Palo Alto, California, CA, December 2006.
• Kosoy, and M. Arik, “Thermal analysis of plastic serpentine-type microchannel evaporators”, ASME International Mechanical Engineering Congress and Exposition, Seattle, WA, November 11-15, 2007.
• Utturkar, M. Arik, and M. Gursoy, “Assessment of cooling enhancement of synthetic jet in conjunction with forced convection”, ASME International Mechanical Engineering Congress and Exposition, IMECE2007-41446, Seattle, WA, November 11-15, 2007.
• Arik, J. Petroski, A. Bar-Cohen, and M. Demiroglu, “Energy efficiency of low form factor cooling devices”, ASME International Mechanical Engineering Congress and Exposition, IMECE2007-41275, Seattle, WA, November 11-15, 2007.
• Icoz, M. Arik, and T. Dardis, “Characterization of light weight heat sink materials for thermal management of electronics”, ASME InterPACK '07, Vancouver, British Columbia, Canada, July 8-12, 2007.
• Arik, Y. Utturkar, and M. Gursoy, “Interaction of synthetic jet cooling performance with gravity and buoyancy driven flows”, ASME InterPACK '07, Vancouver, British Columbia, Canada, July 8-12, 2007.
• E. Seeley, M. Arik, R. Hedeen, M. Shih, T. Wetzel, “ Coupled acoustic and heat transfer modeling of a synthetic jet”, 47th AIAA/ASME/ASCE/AHS/ASC Structures / Structural Dynamics and Materials Conference, Newport, Rhode Island, 1-4 May 2006.
• Gursoy, M. Arik, T. Icoz, M. Yovanovich, B., Theodorian, “Effect of 3D diffusion over vertical thin rectangular geometries in natural convection heat transfer”, ASME Int. Mechanical Engineering Congress and Exposition, IMECE2006-13293, Chicago, Illinois, November 5-10, 2006.
• Utturkar, M. Arik, and M. Gursoy, “An experimental and computational sensitivity analysis of synthetic jet cooling performance”, ASME Int. Mechanical Engineering Congress and Exposition, IMECE2006-13743, Chicago, Illinois, November 5-10, 2006.
• Arik, S. Weaver, A. Setlur, D. Haitko, “Thermal needs and challenges for the solid state lighting devices: Materials to packages”, ASME Int. Mechanical Engineering Congress and Exposition, IMECE2005-79330, Orlando, Florida, November 5-11, 2005.
• S. Yigit, H.M. Ertunc, M. Yakut, M. Arik, “The design of bubble driven micro jet for the thermal management of electronics”, 4th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT2005), Cairo, Egypt, Sep. 19-22, 2005.
• Garg, M. Arik, and S. Weaver, “Impingement air cooling with synthetic jets over small and large heated surfaces”, InterPACK’05 ASME Pacific Rim Technical Conference and Exhibition On Integration and Packaging of MEMS, NEMS and Electronics Systems, IPACK2005-73211, San Francisco, CA, July 17-22, 2005.
• Garg, M. Arik, S. Weaver, and S. Saddoughi, “Micro fluidic jets for thermal management of electronics”, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, North Carolina, July 11-15, 2004.
• Garg, M. Arik, and E. Tkaczyk , “Methodology for computation and measurement of thermal conductivity for thin film composite substrates”, Ninth Intersociety Conference on thermal and Thermo-mechanical Phenomena in Electronic Systems, Las Vegas, June 1-4, 2004.
• Arik and S. Weaver, “Chip scale thermal management of high brightness LED packages”, 2004 SPIE – The International Society of Optical Engineering Annual Conference, Denver, August 2004.
• Arik, C. Becker, S. Weaver, J. Petroski, “Thermal management of LEDs: Package to system”, SPIE’s 48th Annual Meeting, 5187-9, San Diego, CA, 3-8 August 2003.
• Bar-Cohen, A. Watwe, M. Arik, “Pool boiling critical heat flux in dielectric liquids”, 5th International Conference on Boiling Heat Transfer, Montego Bay, Jamaica, May 4-8, 2003.
• Arik, M. Nagupally, S. Brzozowski, and J. Glaser, "Thermal design and optimization of harsh environment power electronics in natural convection heat transfer", ASME Summer Heat Transfer Conference, HT2003-47015, Las Vegas, Nevada, July 21-23, 2003.
• Arik, S. Weaver, C. Becker, M. Hsing, and A. Srivastava, “Effects of localized heat generations due to the color conversion in phosphor particles and layers of high brightness light emitting diodes”, ASME/IEEE International Electronic Packaging Technical Conference and Exhibition - InterPACK’03, Maui, Hawaii, USA, July 6–11, 2003.
• Garg, M. Arik, A. Bar-Cohen, R. Wolf, B. Vukasinovic, J. Hartley, and G.A. Glazer, “Synthetic jet enhancement of natural convection and pool boiling in a dielectric liquid”, 12th Int. Heat Transfer Conference, Grenoble, France, August 18-23, 2002.
• Arik, J. Petroski, and S. Weaver, “Thermal challenges in the future generation solid state lighting applications: Light emitting diodes”, Pro. of the ASME/IEEE 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, May 29, 2002.
• Arik and A. Bar-Cohen, “Ebullient cooling of integrated circuits by Novec fluids”, Proceedings of the ASME/IEEE PACIFIC RIM/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, ASME Paper No: 15515, Hyatt Regency, Kauai, Hawaii, July 8–13, 2001.
• Arik, K. S. Yigit, A. Bar-Cohen, S.M. You, “Correlating surface effects on pool boiling CHF”, ASME Nat. Heat Transfer Conference, Pennsylvania, August 2000.
• Arik and A. Bar-Cohen, “Immersion cooling of high heat flux microelectronics with dielectric liquids”, Int. Symposium and Exhibit on Adv. Packaging Materials: Process, Properties and Materials, Atlanta, GA, pp. 229-247, March 15-18, 1998.
• S. Yigit, M. Arik and A. Bar-Cohen, “New CHF enhancement techniques: Passive impeller micropump and gravity driven fluid flow”, 5th World Conference on Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics, Thessaloniki, September 24-28, 2001.
• Arik, S. M. Zurn, K. S. Yigit, A. Bar-Cohen, “Design, fabrication and experimental-numerical study of PZT sensors”, Pro. of the Modeling and Simulation of Micro Electro Mechanical Systems – MSM 2000, San Diego, CA, March, 2000.
• Arik, S. M. Zurn, A. Bar-Cohen, Y. Nam, D. Markus and D. Polla, “Development of CAD model for MEM micropumps”, Int. Conf. on Modeling and Simulation of Microsystems - MSM 99, P. Rico, 1999.
• Arik, A. Bar-Cohen, “Thermal management of next generation packaging (SLIM)”, Packaging Research Center 2nd Academic Conference, Georgia Institute of Technology, GA, 1998.
• Arik, C.A.C. Santos, S. Kakac, “Experimental and theoretical analyses of unsteady turbulent forced convection with time wise variation of inlet temperature”, International Symposium on Transient Convective Heat Transfer, Cesme, Turkey, August 19-23, 1996.
• Sozbir, M. Arik, S. Kakac, H. I. Sarac, I. Calli, “Experimental investigation of unsteady turbulent forced convection in a rectangular duct with arrays of block-like electronics components”, International Symposium on Transient Convective Heat Transfer, Turkey, August 19-23, 1996.
• Sozbir, D. M. Brown, S. Kakac, M. Arik, C.A.C. Santos, "Unsteady forced flow in parallel plates channel with and without protruding surfaces", 9th International Conference on Thermal Engineering and Thermogrammetry, Hungary, May 31-June 2, 1995.
• Dogan, M. Arik, K.S. Yigit, “Design of air cooled oil cooler for a turbo-prop aircraft”, 1999 Asia-Pacific Conference on the Built Environment, Taipei, Taiwan, November 1999.

Other Publications

• iNEMI Design Technologies – Thermal Management Roadmap, iNEMI 2008, co-authored with 40 international scientists.
• Frontiers in transport phenomena research and education: Energy systems, biological systems, security, information technology and nanotechnology, edited by T.L. Bergman, A. Faghri, R. Viskanta, “co-author for section-5 International Journal of Heat and Mass Transfer 51 (2008) 4599–4613, 2008.
• Aimi, M. Arik, J. Bray, T. Gorczyca, D. Michael, S. Weaver, “Thermotunneling Based Cooling Systems for High Efficiency Buildings”, DOE Final Program Report, OSTI ID: 921025, September 2007.
• iNEMI Design Technologies – Thermal Management Roadmap, iNEMI 2006, co-authored with 36 international scientists.
• iNEMI Design Technologies – Thermal Management Roadmap, iNEMI 2004, co-authored with 14 nationwide scientists.
• Arik, “Enhancement of Pool Boiling Critical Heat Flux in Dielectric Liquids, Ph.D. Dissertation, Department of Mechanical Engineering, University of Minnesota, 2001.
• Sozbir, M. Arik, and S.R. Aporn, “Experimental investigation of unsteady forced convection in rectangular channels with and without blocks-like electronic components”, Technical Report, Department of Mechanical Engineering at The University of Miami, 1995.
• Arik, “An Investigation into Single Phase Forced Convection Turbulent Flow in Rectangular Channels”, Master’s Thesis, University of Miami, December 1995.

Patents

• M Arik et al., “System for measuring junction temperature of photonics devices”, US Patent App. 17/417,821, 2022.
• Arik et al., “Geodetic levelling staff and method of use thereof”, US Patent App. 17/294,708, 2022.
• Arik et al, “HEAT SİNK COOLİNG WİTH PREFERRED SYNTHETİC JET COOLİNG DEVİCES”, US201515511175A, 2015, Ozyegin University.
• Arik et al, “LİGHT ENGİNE SYSTEM PREFFERED İN LED-BASED LİGHTİNG SYSTEMS”, US201615759310, 2016, Ozyegin University.
• Arik et al, “FLOW COOLED SOLID STATE LIGHTING WITH PREFERRED OPTICAL AND ADVANCED SENSING FEATURE”, US201615511170A (TR2018/04359, DE60201600951, EP16782108.1, EP16782108.1, EP16782108.1, EP16782108.1), 2018, Ozyegin University.
• Arik et al, “A FLOW CONTROLLED EFFECTİVE LED BASED LİGHTİNG SYSTEM”, US14/183931, Ozyegin University.
• Arik et al, “PREFERRED OPTOTHERMAL LED LIGHTING EMBODİMENT FOR HİGH LUMEN EXRACTİON AND EXTENDED LİFETİME”, US14/183964, Ozyegin University.
• Arik et al, “LED ESASLI AYDINLATMA SİSTEMLERİNDE TERCİH EDİLEN IŞIK MOTORU SİSTEMİ”, TR2015/14689 (EP16822551.4), 2016, Ozyegin University.
• Arik et al, “IŞIK YAYAN VEYA ABSORBE EDEN SİSTEMLERİN OPTİK YOLLARI İÇİN AYDINLATMA ARA KATMANLARI”, TR2015/16627, 2015, Ozyegin University.
• Arik et al, “PREFERRED THERMAL CONNECTOR FOR ELECTRONIC SYSTEMS”, TR2020/21772, 2020, Ozyegin University.
• Arik et al, “A PREFERRED SYSTEM FOR MEASURING JUNCTION TEMPERATURE OF PHOTONICS DEVICES”, TR2021/010395 (WO2020139208A1), 2021, Ozyegin University.
• Arik et al, “AN OPTICAL ARRANGEMENT FOR A COLLIMATED LIGHT BEAM”, PCT/TR2021/050775, 2021, Ozyegin University.
• Arik et al, “GEODETIC LEVELLING STAFFS AND METHOD OF USE THEREOF”, US17294708, 2021, Ozyegin University.
• Arik et al, “Synthetic jet and method of making same”, US2010079943, October 2010, General Electric.
• Arik et al, “Method and apparatus for reducing acoustic noise in a synthetic jet”, US2010051242, August 2011, General Electric.
• Arik et al, “Heat sinks with distributed and integrated jet cooling”, US8496049, July 2013, General Electric.
• Arik et al, “Thermal management apparatus and uses thereof”, US2005093543, November 2006, General Electric.
• Arik et al, “Unique-cooling scheme for advanced thermal management of high flux electronics”, US20080156462, June 2011, General Electric.
• Arik et al, “System and method for mounting synthetic jets”, US2010051721, December 2011, General Electric.
• Arik et al, “Method, system and apparatus for cooling high power density devices”, EP1570521, March 2009, General Electric.
• Arik et al, “Electronic Devices and methods for making same using nanotube regions to assist in thermal heat-sinking”, JP2007531243, August 2011, General Electric.
• Arik et al, “Apparatus and method for reducing acoustical noise in synthetic jets”, US8564217, October 2013, General Electric.
• Arik et al, “Light emitting diode apparatuses with a thermally superconducting heat transfer medium for thermal management”, US20050258438, August 2006, General Electric.
• Arik et al, “Method of processing high-resolution flex circuits with low distortion”, JP4301924, July 2009, General Electric.
• Arik et al, “Thermal management apparatus and uses thereof”, US20070069843, October 2008, General Electric.
• Arik et al, “Thermal management system for embedded environment and method for making same”, US2010067191, February 2012, General Electric.
• Arik et al, “Device for thermal transfer and power generation”, US20070069357, April 2011, General Electric.
• Arik et al, “Methods and apparatus for temperature measurement and control in electromagnetic coils”, US20050129088, July 2006, General Electric.
• Arik et al, “LED light with active cooling”, US20040190305, April 2007, General Electric.
• Arik et al, “System and method for miniaturization of synthetic jets”, US/2010/0053891 A1, April 2013, General Electric.
• Arik et al, “LED power package”, US20040203189, November 2005, General Electric.
• Arik et al, “Thermal management system and method for MRI gradient coil”, US20060066309, November 2006, General Electric.
• Arik et al, “Method and system for cooling high power density devices”, US20040221603, March 2006, General Electric.
• Arik et al, “Method and apparatus for reducing acoustic noise in a synthetic jet”, US2011220339, November 2012, General Electric.
• Arik et al, “Thermal management systems for solid state lighting and other electronic systems”, US8506105, August 2013, General Electric.
• Arik et al, “Thermal management apparatus and uses thereof”, DE102004053879, June 2013, General Electric.
• Arik et al, “Thermal management apparatus and uses thereof, NL1027290, 13 February 2007.
• Arik et al, “Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus, US2009120615, October 2010, General Electric.
• Arik et al, “LED light with active cooling”, JP20060507466, January 2012, General Electric.
• Arik et al, “Lighting system with thermal management system having point contact synthetic jets”, US8602607, December 2013, General Electric.
• Arik et al, “Lighting system with heat distribution face plate”, US8529097, September 2013, General Electric.
• Arik et al, “Method and system for cooling high power density devices”, CN1914968, June 2010, General Electric.
• Arik et al, “Enhanced heat transfer in MRI gradient coils with phase change materials”, US20080143331, February 2009, General Electric.
• Arik et al, “Device and method to directly control the temperature of microscope slides”, US6300124, October 2001, University of Minnesota/Blizzard Genomics.
• Arik et al, “LED light with active cooling”, US20070147046, June 2009, General Electric.
• Arik et al, “Cooling systems employing fluidic jets, methods for their use and methods for cooling”, US20080041574, November 2011, General Electric.
• Arik et al, “Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking, US2005006754, March 2005, General Electric.
• Arik et al, “Method of processing high-resolution flex circuits with low distortion, FR2848062, 7 November 2003.
• Arik et al, “Method, system and apparatus for cooling high power density devices”, CN1745475, October 2009, General Electric.
• Arik et al, “LED light with active cooling, US20070139938”, July 2009, General Electric.
• Arik et al, “Lighting system with thermal management system”, US2011204790, May 2013, General Electric.
• Arik et al, “Method of processing high-resolution flex circuits with low distortion”, US6994897, February 2006, General Electric.
• Arik et al, “Synthetic jet embedded heat sink”, US2010110630, June 2013, General Electric.
• Arik et al, “Systems and methods for synthetic jet enhanced natural cooling”, US2010271775, August 2011, General Electric.
• Arik et al, “Method and system for cooling high power density devices”, EP1579155, June 2011, General Electric.
• Arik et al, “Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management”, US20060005947, February 2011, General Electric.
• Arik et al, “System and method for mounting a cooling device and method of fabrication”, US20100284147, January 2013, General Electric.
• Arik et al, “System and method for mounting a cooling device and method of fabrication”, US8342819, January 2013, General Electric.
• Arik et al, “System and method for mounting synthetic jets”, US20120018537, January 2012, General Electric.
• Arik et al, “Thermal management systems for solid state lighting and other electronic systems”, US20120051058, March 2012, General Electric.
• Arik et al, “Method and apparatus for improved cooling of a heat sink using a synthetic jet”, US20110174462, July 2011, General Electric.
• Arik et al, “Chassis with distributed jet cooling”, US20110114287, May 2011, General Electric.
• Arik et al, “Method and apparatus for reducing acoustic noise in a synthetic jet”, US20100054973, March 2010, General Electric.
• Arik et al, “Heat transfer and power generation device”, US20080017237, January 2008, General Electric.
• Arik et al, “Wireless monitoring system”, US20070139193, June 2007, General Electric.
• Arik et al, “Heat transfer system for a light emitting diode (LED) lamp”, US20110242826, October 2011, General Electric.
• Arik et al, “Apparatus and method for reducing acoustical noise in synthetic jets, US20110316416, December 2011.
• Arik et al, “Shaped heat sinks to optimize flow”, US20110139429, June 2011, General Electric.
• Arik et al, “Efficient cooling of lasers, LEDs and photonics devices”, US20090001372, January 2009, General Electric.
• Arik et al, “Apparatus for induction heating and method of making”, US20050061803, March 2005, General Electric.
• Arik et al, “Thermal management system for embedded environment and method for making same”, US20080137289, June 2008, General Electric.
• Arik et al, “Advanced het sinks and thermal spreaders”, US20070053168, March 2007, General Electric.
• Arik et al, “Heat sinks with distributed and integrated jet cooling”, US20100258270, October 2010, General Electric.
• Arik et al, “Thermotunneling refrigeration system”, US20090031733, February 2009, General Electric.
• Arik et al, “System and method for mounting a cooling device and method of fabrication”, US20080310110, December 2008, General Electric.
• Arik et al, “Method of processing high-resolution flex circuits with low distortion”, US20040094329, May 2004, General Electric.
• Arik et al, “Method and apparatus for removing heat from electronic devices using synthetic jets”, US20110162823, July 2011, General Electric.
• Arik et al, “LED power package”, US20040188696, September 2004, General Electric.
• Arik et al, “Enhanced heat transfer in MRI gradient coils with phase-change materials”, (US)7489132, February 2009, General Electric.
• Arik et al, “Method and apparatus for reducing acoustic noise in a synthetic jet”, (US)8006917, August 2011, General Electric.
• Arik et al, “Light emitting diode apparatuses with heat pipes for thermal management, General Electric, (US), August 2006, General Electric.
• Arik et al, “System and method for mounting synthetic jets”, (US), December 2011, General Electric.
• Arik et al, “Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus”, (US) 7812604, October 2010, General Electric.
• Arik et al, “Method, system and apparatus for cooling high power density devices”, US20040107718, June 2004, General Electric.
• Arik et al, “Unique cooling scheme for advanced thermal management of high flux electronics”, (US)7969734, June 2011, General Electric.
• Arik et al, “Thermal management system and method for MRI gradient coil”, (US)7135863, November 2006, General Electric.
• Arik et al, “Synthetic jet and method of making same”, (US)7688583, March 2010, General Electric.
• Arik et al, “Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management”, (US)7878232, February 2011, General Electric.
• Arik et al, “Method of processing high-resolution flex circuits with low distortion”, (US)6994897, February 2006, General Electric.
• Arik et al, “Thermal management system for embedded environment and method for making same”, (US)8120908, February 2012, General Electric.
• Arik et al, “Systems and methods for synthetic jet enhanced natural cooling”, (US)7990705, August 2011, General Electric.
• Arik et al, “Device for thermal transfer and power generation”, (US)7928561, April 2011, General Electric.
• Arik et al, “Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking”, (US)6864571, March 2005, General Electric.
• Arik et al, “LED power package”, (US)6964877, November 2005, General Electric.
• Arik et al, “Cooling systems employing fluidic jets, methods for their use and methods for cooling”, (US)8051905, November 2011, General Electric.
• Arik et al, “Thermal management apparatus and uses thereof”, (US)7439741, October 2008, General Electric.
• Arik et al, “LED light with active cooling”, (US)7543961, June 2009, General Electric.
• Arik et al, “Led light with active cooling", (US) 7556406, July 2009, General Electric.
• Arik et al, “Thermal management apparatus and uses thereof”, (US)7140420, November 2006, General Electric.
• Arik et al, “Thermal management system for distributed heat sources”, (US)7606029, October 2009, General Electric.
• Arik et al, “LED light with active cooling”, (US)7204615, 17 April 2007, General Electric.
• Arik et al, “Methods and apparatus for temperature measurement and control in electromagnetic coils”, (US)7077566, July 2006, General Electric.
• Arik et al, “Method and system for cooling high power density devices, (US) 7010930, March 2006, General Electric.
• Arik et al, “Thermal management of batteries using synthetic jets”, (US)8030886, October 2011, General Electric.
• Arik et al, “Synthetic jet heat pipe thermal management system”, (US)7607470, October 2009, General Electric.
• Arik et al, “Energy conversion device”, US20090205695, August 2009, General Electric.

Several more US/PTC/EP patents are pending.