ELEC 7730 - Advanced Plasma Processing for Microelectronic Fabrication

ELEC 7730. Advanced Plasma Processing for Microelectronic Fabrication (3) Lec. 3. Pr., ELEC 6750 or departmental approval.

Plasma reactor design and process optimization, plasma assisted etching and deposition processes, plasma assisted oxidation and surface modification processes, plasma polymerization, plasma induced damages to semiconductor devices.

Lecture: 1:00pm – 1:50pm MWF in BN 235

Textbook: Class notes and selected journal papers.

Reference: List of journals and related publications

Instructor: Y. Tzeng, Professor of Electrical Engineering

Office: BN412, Tel: 844-1869, e-mail: tzengy@eng.auburn

Goals: Students will learn to apply the basic knowledge learned in ELEC 6750 to processing needs for microelectronic fabrication using unique properties of plasmas.

Prerequisites by topics:

1. Basic properties of plasmas

2. Method of generating plasmas

3. Basic microelectronic devices

Topics:

1. Design and optimization of plasma reactors

2. Safety issues for plasma processing

3. Dry etching techniques

4. Cold Plasma assisted chemical vapor deposition techniques

5. Sputtering processes

6. Plasma oxidation, nitridation and other surface modification processes

7. Plasma polymerization

8. Plasma induced damages to semiconductor devices

9. Characterization and optimization of plasma processes

10. Thermal plasmas for materials processing

Grades:

Homework, projects, and presentation 50%

Two tests 15% each

Final exam 20%