The following presentations were given by students taking ELEC 7730.   Each presentation was based on an abstract given to the student.  Students studied the abstracts and related references and presented brief summaries to the class.

 

  1. High-Density Plasma Deposited Silicon Nitride Films For Coating InGaAlAs High-Power Lasers – Venu Krishnardula

 

  1. Differential surface charging of the dielectric during plasma etching and surface charge leakage kinetic - Venu Krishnardula

 

  1. Etching of High K Gate Dielectric and Gate Metal Electrode Candidates - Joseph Wu

 

  1. Surface Morphology Analysis of PET Films Treated with Helium and Helium/Oxygen Atmospheric Plasma - Joseph Wu

 

  1. Effects of Atmospheric Pressure Plasma Treatment on Surface and Mechanical Properties of Silica-Epoxy Composites - Venugopal Krishnardula

 

  1. Mechanism producing bowed profiles in the etching of low-k organic films - Joseph Wu

 

  1. Process and Material Properties Of  PECVD Boron-Doped Amorphous silicon Film – Chakravarthy.S.Yamarthy

 

  1. Plasma Etched Micromachined Silicon Stampers for Plastic Biotechnology Applications - Chakravarthy.S.Yamarthy

 

  1. Properties of Boron Doped Amorphous Silicon Films Obtained with a Low Frequency Plasma - Fei Ding

 

  1. Simultaneous Fault Detection and Identification for Plasma Etching Processes - Fei Ding

 

  1. Forming Mechanism of chitosan Green Coating on Aluminum Cathode by Electrophoresis Process - Fei Ding

 

  1. Pattern transfer into low dielectric materials by high-density plasma etching - Fei Ding

 

  1. Etching and Depostion: The Effect on Profiles and Etching Yeild Curves for Oxide Etching- Venugopal Krishnardula

 

  1. Si Epitaxial Growth on Atomic- Order Nitrided Si(100) Using an ECR Plasma - Zhenwei Hou

 

  1. Application of Nonthermal Plasma to Chemical Reactions - Yu-Chun Chen

 

  1. Analysis of etched low-k organic material surface - Yu-Chun Chen

 

  1. Etching of High Aspect Ratio Trenches - Yu-Chun Chen

 

  1. Beam Study of Plasma-surface Kinetics and Simulation of Feature Profile Evolution  in Cl2 and HBr Etching of Polysilicon - Yu-Chun Chen

 

  1. Integrated Modeling Investigation of Plasma Dielectric Etching Process - Joseph Wu

 

  1. Gate Oxide Integrity And Microloading Characterization of 300mm Process Tools - Wei Yan

 

  1. Fused Hollow Cathode Cold Atmospheric Plasma in Monoatomic and Molecular Gases - Wei Yan

 

  1. A Novel Approach to Reduce Via Corner Faceting in the Via-First, No Middle Stop Layer Dual Damascene Trench Etch - Wei Yan

 

  1. Novel Atmospheric-pressure Plasma Tools and Related Non-equilibrium-plasma technologies - Cai Wang

 

  1. Radical Control in a Hole to Break an Etch-Stop Barrier for High Selective HARC Etching - Cai wang

 

  1. Showerhead Application in Plasma Reactor - Cai Wang

 

  1. Characteristics of low temperature deuterated silicon thin film deposited PECVD - Cai Wang

 

  1. The Evolution of Plasma Etching in Integrated Circuit Manufacturing - Wei Yan

 

  1. Non-thermal Plasma Application for Environmental Control- Johnny Liu

 

  1. Surface Modifications of Organic Polymer Films Treated in Atmospheric Plasmas - Nikhil Mehta

 

  1. High Productivity 300mm HDP-CVD for Next-generation Gap Fill Processes - Nikhil Mehta

 

  1. Potential Industrial Application of the One Atmosphere Uniform Glow discharge Plasma(OAUGDPTM) - Hongtao Ma

 

  1. Patterning 180nm Copper-Oxide Dual Damascene Baseline with 193nm Resists - Hongtao Ma

 

  1. Measurement of Device Charging Damage in a Dielectric Etch 300mm Chamber with a Bias Voltage Diagnostic Cathode - Hongtao Ma

 

  1. Ion Energy Dependence of Etch Selectivity of Low k-polymer to Si3N4by N2 and NH3 Plasma Irradiation - Hongtao Ma

 

  1. Inverse Microloading Effect in Reactive Ion Etching of Silicon - Liu Yen Kang

 

  1. Surface treatment of SiC using NF3/O2 plasma - Liu Yen Kang

 

  1. HBr Plasma Based Copper Etch Process - Liu Yen Kang

 

  1. Intellectual property creation from semiconductor process and equipment development - Chakravarthy.S.Yamarthy

 

  1. Atmospheric Pressure Plasma Jet - Zhenwei Hou

 

  1. SiO2 Etching Characteristics of Perfluoro-2-butene (l-C4F8) and Hexafluoropropene (l-C3F6) - Zhenwei Hou

 

  1. Quantitative Analysis and Comparison of Endpoint Detection Based on Multiple Wavelength Analysis - Zhenwei Hou