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Final Submission Open
Now through October 22, 2008
Author Instruction for SiRF 2009 final paper submission IEEE Conference eXpress author account This 9th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2009) continues to be the only conference devoted to Si-based devices, passives, integrated circuits, and applications for high-frequency systems. Over three days, papers and sessions will highlight the significant technological advances of this dynamic field, as well as provide a unique forum for the presentation of new ideas and candid exchange on emerging challenges and opportunities. Invited tutorial talks from international experts will be presented in key topical areas. A student paper competition will be held, and prizes will be given at the conference banquet. SiRF is part of the IEEE Radio and Wireless Week (RWW), which also includes Radio and Wireless Symposium (RWS) and the Power Amplifier Symposium (PAS). Technical papers are solicited in the following areas, but all papers related to Si-based RF systems are welcome: · RF Circuits: RF Building blocks (LNA, mixer, VCO, PA, drivers, switches, filters, frequency synthesizers), integrated transceivers, high-speed DAC and ADC, integrated transponders, analog/mixed-signal circuit blocks. Both RF CMOS and SiGe BiCMOS designs are welcome. · Si Millimeter Wave ICs: millimeter wave circuits and systems for non-destructive testing, automotive radar, high-bit rate wireless communication, concealed weapon detection and bio-molecular spectroscopy. · RF Systems and Architectures: WLAN, Bluetooth, 802.1x, Telemetry, RFID, system-on-a-chip (SoC) and system-in-a-package (SiP) solutions, integration of Si-based photonic elements. · Devices and Modeling: physics, optimization, layout, testing, and modeling of transistors and passives. · Materials: epitaxial growth, strain engineering, characterization methods, stability issues, defects. · IC Technologies: novel device structures, integration issues, heterogeneously integrated devices and circuits, interconnects, packaging. · Passives and MEMS: inductors, capacitors, thin film resistors, transmission lines, integrated antenna, transformers, RF MEMS, micro-machining for improved passives, integration with Si-based circuits and systems, FBARs. · Emerging Technologies: Nano, quantum, optical, and THz technology devices and circuits, flexible RF. Recent News
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