PROFESSIONAL PUBLICATIONS & PRESENTATIONS:

 

J.E. Rogers, R. Ramadoss, P.M. Ozmun, and R. N. Dean, "A microelectromechanical accelerometer fabricated using printed circuit processing techniques" Journal of Micromechanics and Microengineering, Vol. 18, 2008 (7pp).

 

R. Ramadoss and R. Dean, “MEMS Characterization and Testing”, Chapter 14 in L. T. Wang, C. Stroud, and N. Touba (Eds.), System on Chip Test Architectures: Nanometer Design for Testability, Elsevier, Burlington, MA, First Edition, 2007, pp. 591-652.

 

S. Castro, G. Roth, R. Dean, G. Flowers and B. Grantham, “Influence of acoustic noise on the dynamic performance of MEMS gyroscopes,” Proc of IMECE2007: the 2007 ASME Int. Mech. Eng. Congress and Exposition, Seattle, WA, Nov. 11-15, 2007, 7 pages.

 

R. Dean, J. Pack, N. Sanders, P. Reiner, C.W. Long and R. Fenner, “Porous ceramic packaging for MEMS chemical sensors requiring environmental access,” IEEE Trans on Advanced Packaging, manuscript submitted 10/31/07.

 

R. Dean, G. Flowers, A. Ahmed, A. Hodel, G. Roth, S. Castro, R. Zhou, R. Rifki, A. Moreira, B. Grantham, D. Bittle and J. Brunsch, "On the Degradation of MEMS Gyroscope Performance in the Presence of High Power Acoustic Noise," 2007 IEEE International Symposium on Industrial Electronics (ISIE 2007), Vigo, Spain, June 2007.

 

John E. Rogers, Ramesh Ramadoss, Phillip M. Ozmun, and Robert N. Dean, "MEMS Accelerometer Fabricated Using Printed Circuit Processing Techniques," 2007 IEEE International Symposium on Industrial Electronics (ISIE), Vigo, Spain, June 4-7, 2007.

 

R. Dean, J. Weller, M. Bozack, K. MacAllister, N. Sanders, B. Farrell, L. Jauniskis, J. Ting, D. Edell and J. Hetke, "Realization of Ultra Fine Pitch Traces on LCP Substrates," IEEE Trans. on Components and Packaging Technologies, manuscript accepted 5/14/07.

 

R. Dean, G. Flowers, R. Horvath, N. Sanders, S. Hodel, J. Hung and T. Roppel, “Characterization and Experimental Verification of the Nonlinear Distortion in a Technique for Measuring Relative Velocity between Micromachined Structures in Normal Translational Motion,” IEEE Sensors Journal, Vol. 7, No. 4, April 2007, pp. 496-501.

 

R. Dean, G. Flowers, A. Ahmed, A. Hodel, G. Roth, S. Castro, R. Zhou, R. Rifki, A. Moreira, J. Brunsch, D. Bittle and B. Grantham, "An Investigation of the Deleterious Effects of High Power, High Frequency Acoustic Noise on MEMS Gyroscopes," 2007 International Conference and Exhibition on Device Packaging, Optoelectronics – Photonics Advances in Optoelectronic Packaging, Scottsdale, AZ, March 18-22, 2007.

 

D. K. Harris, A. Palkar and R. Dean, “High Heat Value Micro-Heat-Pipe Arrays Using a Liquid Metal as the Working Fluid,” 2007 International Conference and Exhibition on Device Packaging, MEMS – MEMS and Related Microsystems, AZ, March 18-22, 2007.

 

R. Dean, J. Weller, M. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke, "Micromachined LCP Connectors for Packaging MEMS Devices in Biological Environments,” J. Microelectronics and Electronic Packaging, Vol. 4, No. 1, 1st Qtr. 2007, pp. 17-22.

 

J. E. Rogers, P. M. Ozmun, J. H. Hung and R. N. Dean, “Bi-Directional Gap Closing MEMS Actuator Using Timing and Control Techniques,” Proc. of the 32nd Annual Conference of the IEEE Industrial Electronics Society (IECON 06), Paris, France, Nov. 18, 2006, pp. 3149 -3154.

 

R. Dean, G. Flowers and Dan Harris, “Microsystems Technologies to Augment Liquid Bio-Fuels Production,” Alternative Energy Solutions from Alabama’s Natural Resources Conference, Auburn, AL, October 23-24, 2006, Poster Presentation.

 

A. Anderson, R. Dean, G. Flowers and A. S. Hodel; “Low Cost Test Apparatus for MEMS Inertial Sensors;” Proceedings of The 3rd International Conference on Cybernetics and Information Technologies, Systems and Applications; jointly with The 4th International Conference on Computing, Communications and Control Technologies; Vol. II; Orlando; Florida; July 20-23; 2006; pages 175-179.

 

R. Dean, N. Sanders, J. Pack and P. Reiner, “Porous Ceramic Packaging for MEMS Sensors Requiring Environmental Access,” IMAPS International Conference and Exhibition on Device Packaging, MEMS – Assembly and Packaging Technical Workshop, Scottsdale, AZ, March 20-23, 2006.

 

D. Harris, R. Dean, O. Nadgauda, N. Sanders, C. Ellis and M. Palmer, “A Package Sealing Technique for Mercury Filled Microfluidic Devices,” IMAPS International Conference and Exhibition on Device Packaging, MEMS – Wafer Bonding Technical Workshop, Scottsdale, AZ, March 20-23, 2006.

 

R. Dean, G. Flowers, N. Sanders, R. Horvath, W. Johnson, M. Kranz, and M. Whitley, "Experimental Validation and Testing of Components for Active Damping Control for Micromachined Mechanical Vibration Isolation Filters using Electrostatic Actuation," Proc. of SPIE Smart Structures / NDE Conference, Vol. 6172, San Diego, CA, Feb. 26 - March 2, 2006, pp. 362-372.

 

R. Dean, G. Flowers, N. Sanders, R. Horvath, M. Kranz and M. Whitley, “Micromachined Vibration Isolation Filters to Enhance Packaging for Mechanically Harsh Environments,” J. Microelectronics and Electronic Packaging, Vol. 2, No. 4, 4th Qtr. 2005, pp. 223-231.

 

R. N. Dean, J. Y. Hung, and B. M. Wilamowski, “Advanced Controllers for Microelectro-mechanical Actuators,” 2005 IEEE International Conference on Industrial Technology, Hong Kong, December 14-17, 2005, pp. 899-904.

 

R. Dean, J. Pack, N. Sanders, P. Reiner, “Micromachined LCP for Packaging MEMS Sensors,” IEEE IECON 2005 Conference, Raleigh, NC, Nov. 6-10, 2005, pp. 2363-2367.

 

R. Dean, G. Flowers, N. Sanders, K. MacAllister, R. Horvath, A. S. Hodel, W. Johnson, M. Kranz and M. Whitley, "Active Micromachined Vibration Isolation Filters using Electrostatic Actuation to Enhance Packaging for Mechanically Harsh Environments," IMAPS International Conference and Exhibition on Device Packaging, Proc. CD-only, Scottsdale, AZ, March 13-16, 2005.

 

R. Dean, G. Flowers, N. Sanders, K. MacAllister, R. Horvath, A. S. Hodel, W. Johnson, M. Kranz and M. Whitley, "Damping Control of Micromachined Lowpass Mechanical Vibration Isolation Filters using Electrostatic Actuation with Electronic Signal Processing," Proceedings of the SPIE International Symposia on Smart Structures & Materials, SPIE Vol. 5760, San Diego, CA, March 6-10, 2005, pp. 11-22.

 

R. Dean, G. Flowers, K. MacAllister, N. Sanders, and M. Kranz, "Micromachined Packaging Structures for Isolating Sensitive Devices from High Frequency Mechanical Vibrations," IMAPS Workshop on Packaging of MEMS and Related Micro-Nano-Bio Integrated Systems, Long Beach, CA, Nov. 18-19, 2004.

 

R. Dean, J. Weller, M. Bozack, K. MacAllister, N. Sanders, B. Farrell, L. Jauniskis, J. Ting, D. Edell and J. Hetke, "Surface Micromachining of Thin Films on LCP Substrates for Biomedical Applications," IMAPS Workshop on Packaging of MEMS and Related Micro-Nano-Bio Integrated Systems, Long Beach, CA, Nov. 18-19, 2004.

 

R. Dean, J. Weller, M. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke, "Novel Biomedical Implant Interconnects Utilizing Micromachined LCP," Proceedings of the International Symposia on Optical Science and Technology, SPIE Vol. 5515, Denver, CO, Aug. 2-6, 2004, pp. 88-99.

 

B. Farrell, P. Jaynes, W. Johnson and R. Dean, "The Liquid Crystal Polymer Packaging Solution," IMAPS 2003, The 36th International Symposium on Microelectronics, Boston, MA, Nov. 16-20, 2003.

 

B. Farrell P. Jaynes, W. Johnson and R. Dean," The Liquid Crystal Polymer Packaging Solution," MICRO SYSTEM Technologies 2003, Munich, Germany, Oct. 6-8, 2003.

 

R. Dean, T. Baginski, M. Bozack, C. Ellis, G. Flowers, R. W. Johnson, N. Schutz, Y. Tzeng, and S. Wentworth, "Microsystems Research at Auburn University," Workshop on Nano and Microsystems Technology and Metrology, Huntsville, AL, Dec 4-5, 2002.

 

C. Ellis, R. Dean, L. Almeida and I. Anderson, "Quad Electrostatic Inchworm Drive Optical Actuator," Workshop on Nano and Microsystems Technology and Metrology, Huntsville, AL, Dec 4-5, 2002.

 

R. Dean, N. Schutz and L. Thomas, "Microsystems and Packaging Applications," Liquid Crystal Polymer Material Processing & Applications Symposium, Huntsville, AL, Oct 29, 2002.

 

R. Dean, N. Schutz, L. Thomas and S. Tully, “MEMS Devices in Printed Circuit Board Technology,” IMAPS Advanced Technology Workshop on Packaging of MEMS & Related Micro Integrated Nano Systems, Denver, CO, Sept 6-8, 2002.

 

B. Farrell, P. Jaynes, D. Kubiak, and R. Dean, “Microfabrication Techniques for Liquid Crystal Polymer Substrates,” IMAPS Advanced Technology Workshop on Packaging of MEMS & Related Micro Integrated Nano Systems, Denver, CO, Sept 6-8, 2002.

 

R. Dean, R. W. Johnson, H. Garrison, N. Schutz, M. Kranz, B. Bowers, B. Payne and R. Legowik, “Strategies for Successfully Integrating MEMS Die onto Laminate,” IMAPS 2002, Proceedings 2002, Denver, CO, Sept. 4-6, 2002, pp. 109-114.

 

R. Dean, G. Flowers, S. Hodel, K. MacAllister, R. Horvath, A. Matras, G. Robertson and R. Glover, “Vibration Isolation of MEMS Sensors for Aerospace Applications,” Proceedings of the IMAPS International Conference and Exhibition on Advanced Packaging and Systems, Reno, NV, March 10-13, 2002, pp. 166-170.

 

R. Dean, H. Garrison, C. Ellis, G. Robertson and N. Schutz, “Micro Machining of LCP for MEMS Applications,” LCP Materials Symposium, sponsored by PMTEC and AMCOM, Huntsville, AL, January 17, 2002.

 

M. Kranz, R. Legowik, W. Bowers, R. Dean, H. Garrison and N. Shultz, "Micro-Packaging of COTS MEMS for Remote Monitoring Systems," 3rd Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, IMAPS, Scotts Valley, CA, Nov. 8-10, 2001.

 

R. Dean, C. Ellis, G. Robertson, L. Thomas, N. Schutz, S. Tully and H. Garrison, “MEMS Vacuum Tooling for Handling Micro-Optics,” 3rd Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, IMAPS, Scotts Valley, CA, Nov. 8-10, 2001.

 

R. Dean, A. Matras, L. Thomas, H. Garrison, N. Schutz, K. MacAllister and S. Tully, “A Laminate Based MEMS Accelerometer,” 3rd Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, IMAPS, Scotts Valley, CA, Nov. 8-10, 2001.

 

R. Dean, C. Ellis and H. Garrison, “A Novel Method for Handling MEMS Die,” Workshop on Microsystems Technology and Applications, Huntsville, AL, July 2001.

 

D. Strembicke, A Werkheiser, R. Dean, R. W. Johnson, “A Novel Flip-Chip Packaging Method for 3-Axis MEMS Accelerometers,” IMAPS Advanced Technology Workshop, Packaging and Integration of MEMS & Related Microsystems, Orlando, FL, Nov. 10-12, 2000.

 

M. Kranz, B. Bowers, R. Dean, R. Legowik, “Advanced Manufacturing Techniques for Integration of COTS MEMS into Missile Health Monitoring Systems,” poster presentation, The Knowledge Foundation, Inc. COTS MEMS Conference, Berkeley, CA, August 3 & 4, 2000.

 

S. Pan, H. Garrison, R. W. Johnson, M. Palmer, R. Dean, R. Thompson, and J. Evans, “Conductive Adhesives for Under-the-Hood Automotive Applications,” Fifth International High Temperature Electronics Conference, Albuquerque, NM, June 2000.

 

D. M. Brown, R. Dean, J. D. Brown “LED Backlight: Design, Fabrication, and Testing,” SPIE Vol. 3938, January 2000, pp. 180-187.

 

R. Dean, P. Nordine and C. Christodoulou, “A Novel Method for Fabricating 3-D Helical THz Antennas Directly on Semiconductor Substrates,” Microwave and Optical Technology Letters, January 20, 2000, pp. 106-111.

 

R. Dean, P. Nordine and C. Christodoulou, “A Novel Method for Fabricating 3-D Helical THz Antennas Directly on Semiconductor Substrates,” SPIE Vol. 3617, January 1999, pp. 67-77.

 

R. Durrett, R. Dean, D. F. McCartney, and E. A. Viveiros, “Interface and Post-Processing Requirements to Insert an Acousto-Optic Range-Doppler Processor into an Advanced Radar Digital Signal Processor,” SPIE Vol. 2489, April 1995, pp. 165-176.

 

PATENTS:

 

 “Nonlinear Feedback Control to Enhance Stable Performance of Micromachined Electrostatic Analog-Range Actuators;” Robert Neal Dean, Jr. and John Y. Hung; U.S. provisional patent filed June 20, 2005.

 

“A Micromachined Device Utilizing Electrostatic Comb Drives to Filter Mechanical Vibrations;” Robert Neal Dean, Jr. and George Timothy Flowers; U.S. patent filed June 10, 2005.

 

 “Three Dimensional Micromachined Electromagnetic Device and Associated Methods;” Rodney L. Clark and Robert N. Dean, Jr.; patent number: 6,271,802; awarded August 7, 2001.