Auburn University, Samuel Ginn College of Engineering

			MECHANICAL ENGINEERING SAMUEL GINN COLLEGE OF ENGINEERING
FACULTY PROFILE
Academics				ME Department	Faculty	Auburn University

Courses Research Publications Biography Email Prof. Lall
					Pradeep Lall

					*Thomas Walter Professor* Department of Mechanical Engineering

					B.E., 1988, Delhi College of Engineering, University of Delhi; M.S., 1989, Ph.D., 1993, University of Maryland at College Park; MBA, 2002, Kellogg School of Management, Northwestern University



				Current Positions Held Thomas Walter Professor, Auburn University, 2006 - present Associate Director, CAVE, 2004 - present Previous Positions Held Thomas Walter Associate Professor, Auburn University, 2005 - 2006 Associate Professor, Auburn University, 2002 - 2006 Motorola, Inc., 1994 - 2002 Assistant Director, CALCE Center, 1992 - 1994 Teaching Interests Continuum Mechanics and Tensor Analysis Finite Element Methods Principles of Nano-Scale Mechanics Energy Methods and Variational Mechanics Fundamentals of Bio-Mechanics: Trauma and Injury Entrepreneurship, Strategic Management of Technology and Innovation Risk-Management, Hedging, Valuation of Technology Ventures Honors and Awards Samuel Ginn College of Engineering Senior Faculty Research Award (2007) Best Student-Poster Award, ASME InterPACK (2007) Best Conference-Paper Award, ECTC (2005) Eleven Best-Paper Awards at Technical Conferences Five Motorola Engineering Awards (1997, 1999) Jane-Robertson Memorial Award Scholar Award (2000) Three Motorola Outstanding Innovation Awards (1995-97). Professional Leadership Associate Editor, IEEE Transactions on Components and Packaging Technologies Associate Editor, IEEE Transactions on Manufacturing Associate Editor, ASME Journal of Electronic Packaging Track Chair, ASME InterPACK, Modeling and Simulation, 2007 Vice-Chair, SEM Electronic Packaging Technical Division, 2005. Chair, ECTC Modeling and Simulation Technical Committee, 2004-05 Track Co-Chair, ASME InterPACK, Modeling and Simulation, 2005 Program Chair, EPPD, ASME IMECE, 2004 Associate Editor, IEEE Transactions on Reliability, 1994-2000 Research Areas Electronic Reliability Prognostics Material Constitutive Behavior Nano-Composites Failure Mechanisms Life Prediction Models Explicit Dynamics. Patents Method and Apparatus for Extending Fatigue Life of Solder Joints in Semiconductor Device, US Patent No. 6,444,563, 2002 Surface Mountable Flexible Interconnect, US Patent No. 5,928,001, 1999 Flexible Connector For Circuit Boards, US Patent No. 5,742,484, 1998. Selected Books & Book Chapters Cooling in Electronic Applications, P. Lall in - Handbook of Thermal Engineering edited by Frank Kreith, CRC Press, Boca Raton, Florida, pp.4-505, December 1999. Semiconductor Devices: Chip-Scale Packaging, P. Lall, in - Encyclopedia of Electrical and Electronics Engineering, edited by J. Webster, John Wiley & Sons, New York, NY, 1999. Estimating the Influence of Temperature on Microelectronic Reliability, by P. Lall, Pecht, M., Hakim, E., CRC Press, Inc., Boca Raton, Florida, 1997. Selected Recent Papers Thermo-Mechanical Reliability Based Part Selection Models for Addressing Part Obsolescence in CBGA, CCGA, FLEXBGA, and Flip-Chip Packages, Lall, P., G. Hariharan, A. Shirgaokar, J. Suhling, M. Strickland, J. Blanche, Proceedings of the ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33832, pp. 1-18, July 8-12, 2007. Transient-Response Spectral Analysis Based Feature Extraction For Built-In Reliability Test of Electronics Under Shock Loads, Lall, P., P. Choudhary, S. Gupte, P. Gupta, J. Suhling, ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33872, pp. 1-19, July 8-12, 2007. Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses, Lall, P., M. Hande, C. Bhat, J. Suhling, ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33876, pp. 1-19, July 8-12, 2007. Die Stress Variation During Thermal Cycling Reliability Tests, Rahim, M. K., J. Roberts, J. C. Suhling, R. C. Jaeger, P. Lall, Proceedings of the ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33548, pp. 1-12, July 8-12, 2007. Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics, Lall, P., S. Gupte, P., Choudhary, J. , Suhling, R., Darveaux, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 515-527, May 29 – June 1, 2007. High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics, Lall, P., D. Panchagade, D. Iyengar, S. Shantaram, J. Suhling, H. Schrier, 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 924-939, May 29 – June 1, 2007. Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads, Lall, P., M. Hande, C. Bhat, J. Suhling, Jay Lee, 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1097-1111, May 29 – June 1, 2007. Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads, Lall, P., P. Choudhary, S. Gupte, J. Suhling, J. Hofmeister, 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1161-1178, May 29 – June 1, 2007. The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints, Ma, H., J. Suhling, Y. Zhang, P. Lall, M. Bozack, 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 653-668, May 29 – June 1, 2007. Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing, Rahim, M. K., J. Roberts, J. C. Suhling, R. C. Jaeger, P. Lall, 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1478-1489, May 29 – June 1, 2007. Solder-Joint Reliability in Electronics Under Shock and Vibration using Explicit Finite Element Sub-modeling, Lall, P., Gupte, S., Choudhary, P., Suhling, J., IEEE Transactions on Electronic Packaging Manufacturing, Vol. 30, No. 1, pp.74-83, January 2007.