MECHANICAL  ENGINEERING

   SAMUEL  GINN  COLLEGE OF  ENGINEERING

 
FACULTY PROFILE

Academics

ME Department

Faculty

Auburn University

 

  Courses

  Research

  Publications



  Biography

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Pradeep Lall

 

Thomas Walter Professor

Department of Mechanical Engineering

 

Director

NSF Center for Advanced Vehicle and

Extreme Environment Electronics (CAVE3)

 

B.E., 1988, Delhi College of Engineering,

University of Delhi; M.S., 1989, Ph.D.,

1993, University of Maryland at College

Park; MBA, 2002, Kellogg School of

Management, Northwestern University

Current Positions Held

Thomas Walter Professor, Auburn University, 2006 - present

Director, CAVE, 2008 - present

 

Previous Positions Held

Associate Director, CAVE, 2004 - 2008

Thomas Walter Associate Professor, Auburn University, 2005 - 2006

Associate Professor, Auburn University, 2002 - 2006

Motorola, Inc., 1994 - 2002

Assistant Director, CALCE Center, 1992 - 1994

Teaching Interests

Continuum Mechanics and Tensor Analysis

Finite Element Methods

Principles of Nano-Scale Mechanics

Energy Methods and Variational Mechanics

Fundamentals of Bio-Mechanics: Trauma and Injury

Entrepreneurship, Strategic Management of Technology and Innovation

Risk-Management, Hedging, Valuation of Technology Ventures

Honors and Awards

Fellow of ASME (2008)

Best of Conference Proceedings Paper Award, SMTAI (2008)

Samuel Ginn College of Engineering Senior Faculty Research Award (2007)

Best Student-Poster Award, ASME InterPACK (2007)

Best Conference-Paper Award, ECTC (2005)

Eleven Best-Paper Awards at Technical Conferences

Five Motorola Engineering Awards (1997, 1999)

Jane-Robertson Memorial Award Scholar Award (2000)

Three Motorola Outstanding Innovation Awards (1995-97). 

 

 

Professional Leadership

Associate Editor, IEEE Transactions on Components and Packaging Technologies

Associate Editor, IEEE Transactions on Manufacturing

Associate Editor, ASME Journal of Electronic Packaging

Track Chair, ASME InterPACK, Modeling and Simulation, 2007

Vice-Chair, SEM Electronic Packaging Technical Division, 2005. 

Chair, ECTC Modeling and Simulation Technical Committee, 2004-05

Track Co-Chair, ASME InterPACK, Modeling and Simulation, 2005

Program Chair, EPPD, ASME IMECE, 2004

Associate Editor, IEEE Transactions on Reliability, 1994-2000

Research Areas

Electronic Reliability

Prognostics

Material Constitutive Behavior

Nano-Composites

Failure Mechanisms

Life Prediction Models

Explicit Dynamics.

Patents

Method and Apparatus for Extending Fatigue Life of Solder Joints in Semiconductor Device, US Patent No. 6,444,563, 2002

Surface Mountable Flexible Interconnect, US Patent No. 5,928,001, 1999

Flexible Connector For Circuit Boards, US Patent No. 5,742,484, 1998.

Selected Books & Book Chapters

  1. Mechanical Design of Electronic Systems, J. Dally, P. Lall, J. Suhling, 664 Pages, College House Enterprises, 2008.

  2. Nano-Underfills for Fine-Pitch Electronics, Lall, P., Islam, S., Tian, G., Suhling, J., Shinde, D., in Nano-Packaging: Nanotechnologies in Electronics Packaging, edited by James Morris, pp. 287-323, Springer, 2008.

  3. Electronic Packaging Applications, Suhling, J., Lall, P., in Handbook of Experimental Solid Mechanics, edited by William Sharpe, pp. 1015-1044, Springer, 2008

  4. Cooling in Electronic Applications, P. Lall in - Handbook of Thermal Engineering edited by Frank Kreith, CRC Press, Boca Raton, Florida, pp.4-505, December 1999.

  5. Semiconductor Devices: Chip-Scale Packaging, P. Lall, in - Encyclopedia of Electrical and Electronics Engineering, edited by J. Webster, John Wiley & Sons, New York, NY, 1999.

  6. Estimating the Influence of Temperature on Microelectronic Reliability, by P. Lall, Pecht, M., Hakim, E., CRC Press, Inc., Boca Raton, Florida, 1997.

Selected Recent Papers

  1. Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics, Lall, P., Shirgaokar, A., Suhling, J., IMECE2008-68274, pp. 1-17, ASME International Mechanical Engineering Congress and Exhibition, Boston, MA, Oct 31-Nov 6, 2008

  2. Prognostication and Health Monitoring of Electronics in Implantable Biological Systems, Lall, P., Gupta, P., Kulkarni, M., Panchagade, D., Suhling, J., Hofmeister, J., IMECE2008-68275, pp. 1-15, ASME International Mechanical Engineering Congress and Exhibition, Boston, MA, Oct 31-Nov 6, 2008

  3. Survivability Assessment of SAC Leadfree Packaging Under Shock and Vibration using Optical High-Speed Imaging, Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J., Proceedings of the SMTAI, Orlando, Florida, pp. 519-531, Aug 17-21, 2008.

  4. Properties of Mixed Formulation Solders, Zhang, Y., Mitchell, C., Suhling, J. C., Evans, J., Lall, P., Bozack, M., Proceedings of the SMTAI, Orlando, Florida, pp. 644-651, Aug 17-21, 2008.

  5. Characterization of Stress In High Performance Server Microprocessors, Roberts, J., Rahim, K., Suhling, J., Jaeger, R., Lall, P., Proceedings of the 2008 SEM XI International Congress and Exposition on Experimental and Applied Mechanics, Orlando, Florida, Paper 399, pp. 1-12, June 2-5, 2008

  6. Algorithms for Prognostication of Prior Damage and Residual Life in Lead-Free Electronics Subjected to Thermo-Mechanical Loads, Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 638-651, May 28-31, 2008

  7. Physical Aging and Evolving Mechanical Behavior of Underfill Encapsulants, Lin, C., Suhling, J., Lall, P., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 695-704, May 28-31, 2008

  8. Die Stress Variation in Area Array Components Subjected to Accelerated Life Testing, Roberts, J., Rahim, K., Hussain, S., Suhling, J., Jaeger, R., Lall, P., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 705-713, May 28-31, 2008

  9. Health Monitoring of Implantable Biological Electronic Systems by Statistical Pattern Recognition Techniques, Lall, P., Gupta, P., Choudhary, P., Kulkarni, M., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 726-737, May 28-31, 2008

  10. Principal Component Regression Models for Life Prediction of Plastic Ball Grid Arrays On Copper-Core and No-Core Assemblies, Lall, P., Shirgaokar, A., Drake, L., Moore, T., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 770-785, May 28-31, 2008

  11. Development of Survivability Envelopes for SnAg Leadfree Packaging Architecures under Shock and Vibration, Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 822-835, May 28-31, 2008

  12. Finite Element Models for Simulation of Wear in Electrical Contacts, Lall, P., Shinde, D., Rickett, B., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 836-841, May 28-31, 2008

  13. The Effects of Aging Temperature on SAC Solder Joint Material Behavior and Reliability, Zhang, Y., Cai, Z., Suhling, J., Lall, P., Bozack, M. J., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 99-112, May 27-30, 2008

  14. Interrogation of System State for Damage Assessment in Lead-free Electronics Subjected to Thermo-Mechanical Loads, Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R, Pandher, R., Suhling, J., Goebel, K., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 918-929, May 27-30, 2008

  15. Time-Frequency and Auto-Regressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems, Lall, P., Gupta, P., Kulkarni, M., Panchagade, D., Suhling, J., Hofmeister , J., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 1196-1207, May 27-30, 2008

  16. Stress Measurements in Large Area Array Flip Chip Microprocessor Chips, Roberts, J., Rahim, K., Suhling, J., Jaeger, R., Lall, P., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 1462-1471, May 27-30, 2008

  17. Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies, Lall, P., Choudhary, P., Gupte, S., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 173-183, March 2008.

  18. Nano-Underfills for High-Reliability Applications in Extreme Environments, Lall, P., Islam, S., Suhling, J., Tian, G., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 114-125, March 2008.

  19. Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging, Lall, P., Panchagade, D., Choudhary, P., Gupte, S., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 104-113, March 2008.

  20. System Design Issues for Harsh Environment Electronics Employing Metal-backed Laminate Substrates, Evans, J., Lall, P., Crain, E., Shete, T., Thompson, J. R., Naylis, D., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 74-85, March 2008.

  21. Thermo-mechanical Reliability Management Models for Area-Array Packages on Cu-Core and No-Core Assemblies, Lall, P., Shah, M., Drake, L., Moore, T., Suhling, J., SMTA Journal, Vol. 21, No. 3, pp. 20-35, 2008.

  22. KEYNOTE PRESENTATION: Feature Extraction and Health Monitoring using Image Correlation for Survivability of Leadfree Packaging under Shock and Vibration, Lall, P., Iyengar, D., Shantaram, S., S., Gupta, P., Panchagade, D., Suhling, J., Proceedings of the 9th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSIME), Freiburg, Germany, pp. 594-608, April 16-18, 2008.

  23. Aging Induced Evolution of Free Solder Material Behavior, Ma, H., Zhang, Y., Cai, Z., Suhling, J., Lall, P., Bozack, M., Proceedings of the 9th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSIME), Freiburg, Germany, pp. 335-346, April 16-18, 2008.