MECHANICAL  ENGINEERING

   SAMUEL  GINN  COLLEGE OF  ENGINEERING

 
FACULTY PROFILE

Academics

ME Department

Faculty

Auburn University

 

  Courses

  Research

  Publications

  NSF-CAVE3



  Biography

  Email Prof. Lall

 











 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  

Pradeep Lall

 

Thomas Walter Professor

Department of Mechanical Engineering

 

Director

NSF-CAVE3 Electronics Research

Center (CAVE3)

 

B.E., 1988, Delhi College of

Engineering, University of Delhi;

M.S., 1989, Ph.D., 1993, University of

Maryland at College Park; MBA, 2002,

Kellogg School of Management,

Northwestern University

Current Positions Held

Thomas Walter Professor, Auburn University, 2006 - present

Director, NSF-CAVE3, 2008 - present

 

Previous Positions Held

Associate Director, NSF-CAVE3, 2004 - 2008

Thomas Walter Associate Professor, Auburn University, 2005 - 2006

Associate Professor, Auburn University, 2002 - 2006

Motorola, Inc., 1994 - 2002

Assistant Director, CALCE Center, 1992 - 1994

Teaching Interests

Continuum Mechanics and Tensor Analysis

Finite Element Methods

Principles of Nano-Scale Mechanics

Energy Methods and Variational Mechanics

Fundamentals of Bio-Mechanics: Trauma and Injury

Entrepreneurship, Strategic Management of Technology and Innovation

Risk-Management, Hedging, Valuation of Technology Ventures

Honors and Awards

Member, National Academies Committee on Electronics Vehicle

 Controls and Unintended Acceleration (2010)

Best of Conference Proceedings Paper Award, SMTAI, 2010

Best of Conference Proceedings Paper Award, ECTC, 2010

Fellow of ASME (2008)

Best of Conference Proceedings Paper Award, SMTAI (2008)

Samuel Ginn College of Engineering Sr Faculty Research Award (2007)

Best Student-Poster Award, ASME InterPACK (2007)

Best Conference-Paper Award, ECTC (2005)

Fourteen Best-Paper Awards at Technical Conferences

Five Motorola Engineering Awards (1997, 1999)

Jane-Robertson Memorial Award Scholar Award (2000)

Three Motorola Outstanding Innovation Awards (1995-97). 

 

 

Professional Leadership

Associate Editor, IEEE Transactions on Components and Packaging Technologies

Associate Editor, ASME Journal of Electronic Packaging

Founding Faculty Advisor, SMTA Student Chapter, Auburn University

Associate Editor, IEEE Transactions on Manufacturing

Member, IEEE Reliability Society Advisory Committee, 2010-present

Member, Editorial Advisory Board, SMTA Journal

General Chair, ASME IMECE 2010

Track Co-Chair, ASME InterPACK 2011
Chair, Modeling and Simulation Committee, ECTC, 2010
Congress Steering Committee, ASME, 2009-present
Program Technical-Chair, ASME IMECE 2009
Program Technical Vice-Chair, ASME IMECE 2008

Research Areas

Electronic Reliability

Prognostics

Material Constitutive Behavior

Nano-Composites

Failure Mechanisms

Life Prediction Models

Explicit Dynamics.

Patents

Method and Apparatus for Extending Fatigue Life of Solder Joints in Semiconductor Device, US Patent No. 6,444,563, 2002

Surface Mountable Flexible Interconnect, US Patent No. 5,928,001, 1999

Flexible Connector For Circuit Boards, US Patent No. 5,742,484, 1998.

Selected Books & Book Chapters

  1. Mechanical Design of Electronic Systems, J. Dally, P. Lall, J. Suhling, 664 Pages, College House Enterprises, 2008.

  2. Nano-Underfills for Fine-Pitch Electronics, Lall, P., Islam, S., Tian, G., Suhling, J., Shinde, D., in Nano-Packaging: Nanotechnologies in Electronics Packaging, edited by James Morris, pp. 287-323, Springer, 2008.

  3. Electronic Packaging Applications, Suhling, J., Lall, P., in Handbook of Experimental Solid Mechanics, edited by William Sharpe, pp. 1015-1044, Springer, 2008

  4. Cooling in Electronic Applications, P. Lall in - Handbook of Thermal Engineering edited by Frank Kreith, CRC Press, Boca Raton, Florida, pp.4-505, December 1999.

  5. Semiconductor Devices: Chip-Scale Packaging, P. Lall, in - Encyclopedia of Electrical and Electronics Engineering, edited by J. Webster, John Wiley & Sons, New York, NY, 1999.

  6. Estimating the Influence of Temperature on Microelectronic Reliability, by P. Lall, Pecht, M., Hakim, E., CRC Press, Inc., Boca Raton, Florida, 1997.

Selected Recent Papers

  1. Lall, P., Lowe, R. Goebel, K., Prognostics and Health Monitoring of Electronic Systems, Conference Technical Keynote at EuroSIME, 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, pp. 1-17, April 17-20, 2011

  2. Prognostics Using Kalman-Filter Models and Metrics for Risk Assessment in BGAs Under Shock and Vibration Loads, Lall, P., Lowe, R., Goebel, K., 60th ECTC, pp. 889-901, Las Vegas, Nevada, June 1-4, 2010.

  3. Assessment of Residual Damage in Lead-free Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling, Lall, P., Vaidya, R., More, V., Goebel, K., Suhling, J., 60th ECTC, pp. 206-218, Las Vegas, Nevada, June 1-4, 2010. .

  4. Self-Organized Mapping of Failure Modes in Portable Electronics Subjected to Drop and Shock, Lall, P., Gupta, P., Panchagade, D., 60th ECTC, pp. 1195-1208, Las Vegas, Nevada, June 1-4, 2010.

  5. Board Trace Fatigue Models and Design Guidelines for Electronics Under Shock-Impact Lall P., Angral, A., Suhling, J., 11th ITHERM, pp. 1-7, Las Vegas, NV, June 2-5, 2010.

  6. Digital-Image Correlation and XFEM Based Shock-Reliability Models for Leadfree and Advanced Interconnects, Lall, P., Kulkarni, M., Angral, A., Panchagade, D., Suhling, J., 60th ECTC, pp. 91-105, Las Vegas, Nevada, June 1-4, 2010.

  7. Peridynamic-Models Using Finite Elements for Shock and Vibration Reliability of Lead-free Electronics Lall, P., Shantaram, S., Panchagade, D., 11th ITHERM, pp. 1-12, Las Vegas, NV, June 2-5, 2010.

  8. Characterization of Microprocessor Chip Stress Distributions During Component Packaging and Thermal Cycling, Roberts, J., Hussain, S., Rahim, M.K., Motalab, M., Suhling, J., Jaeger, R., Lall, P., Zhang, R., 60th ECTC, pp. 1281-1295, Las Vegas, Nevada, June 1-4, 2010.

  9. Reduction of Lead Free Solder Aging Effects using Doped SAC Alloys, Cai, Z., Zhang, Y., Suhling, J., Lall, P., Johnson, R.W., Bozack, M., 60th ECTC, pp. 1493-1511, Las Vegas, Nevada, June 1-4, 2010.

  10. PHM-Based Residual Life Computation of Electronics Subjected to a Combination of Multiple Cyclic-Thermal Environments, Lall, P., Vaidya, R., More, V., Suhling, J., Goebel, K., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  11. Use of Prognostics in Risk-Based Decision Making for BGAs under Shock and Vibration Loads, Lall, P., Lowe, R., Goebel, K., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  12. Fault-Isolation in Portable Electronics Subjected to Drop and Shock, Lall, P., Gupta, P., Panchagade, D., Angral, A., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  13. Thermo-Mechanical Reliability of SAC Leadfree Alloys, Lall, P., Hinshaw, R., Harsha, M., Suhling, J., Pandher, R., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  14. Measurement of Die Stress Distributions in Flip Chip CBGA Packaging, Roberts, J., Hussain, S., Rahim, M.K., Motalab, M., Suhling, J., Jaeger, R., Lall, P., Zhang, R., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  15. The Influence of Aging on the Stress-Strain and Creep Behavior of SAC Solder Alloys, Zhang, Y., Cai, Z., Mustafa, M., Suhling, J., Lall, P., Bozack, M., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.