Department of Mechanical Engineering

Auburn University

Lall, Pradeep :     Selected Recent Publications


Areas of Interest:

Mechanical Behavior of Materials, Computational Mechanics, Electronic Packaging, Nano-Structures, Reliability, Prognostics, Failure Mechanisms, Life Prediction. 



  1. Thermo-Mechanical Reliability Based Part Selection Models for Addressing Part Obsolescence in CBGA, CCGA, FLEXBGA, and Flip-Chip Packages, Lall, P., G. Hariharan, A. Shirgaokar, J. Suhling, M. Strickland, J. Blanche, Proceedings of the ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33832, pp. 1-18, July 8-12, 2007. 

  2. Transient-Response Spectral Analysis Based Feature Extraction For Built-In Reliability Test of Electronics Under Shock Loads, Lall, P., P. Choudhary, S. Gupte, P. Gupta, J. Suhling, ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33872, pp. 1-19, July 8-12, 2007. 

  3. Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses, Lall, P., M. Hande, C. Bhat, J. Suhling, ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33876, pp. 1-19, July 8-12, 2007. 

  4. Die Stress Variation During Thermal Cycling Reliability Tests, Rahim, M. K., J. Roberts, J. C. Suhling, R. C. Jaeger, P. Lall, Proceedings of the ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33548, pp. 1-12, July 8-12, 2007. 

  5. Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics, Lall, P., S. Gupte, P., Choudhary, J. , Suhling, R., Darveaux, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 515-527, May 29-June 1, 2007. 

  6. High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics, Lall, P., D. Panchagade, D. Iyengar, S. Shantaram, J. Suhling, H. Schrier, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 924-939, May 29-June 1, 2007. 

  7. Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads, Lall, P., M. Hande, C. Bhat, J. Suhling, Jay Lee, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1097-1111, May 29-June 1, 2007. 

  8. Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads, Lall, P., P. Choudhary, S. Gupte, J. Suhling, J. Hofmeister, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1161-1178, May 29-June 1, 2007. 

  9. The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints, Ma, H., J. Suhling, Y. Zhang, P. Lall, M. Bozack, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 653-668, May 29-June 1, 2007. 

  10. Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing, Rahim, M. K., J. Roberts, J. C. Suhling, R. C. Jaeger, P. Lall, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1478-1489, May 29-June 1, 2007. 

  11. Solder-Joint Reliability in Electronics Under Shock and Vibration using Explicit Finite Element Sub-modeling, Lall, P., Gupte, S., Choudhary, P., Suhling, J., IEEE Transactions on Electronic Packaging Manufacturing, Vol. 30, No. 1, pp.74-83, January 2007. 

  12. Feature Extraction and Damage Data for Prognostication of Leaded and Leadfree Electronics, Lall, P., Hande, M., Singh, N., Suhling, J., Lee, J., Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California, pp.718-727, May 30-June 2, 2006. 

  13. Temperature and Time-Dependent Property Prediction and Validation for Nano-Underfills using RSA based RVE Algorithms, Lall, P., Islam, S., Suhling, J., Tian, G., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.906-920, May 30-June 2, 2006. 

  14. Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies, Lall, P., Choudhary, P., Gupte, S., Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California, pp.85-94, May 30-June 2, 2006. 

  15. Effects of Aging on the Stress-Strain and Creep Behaviors of Lead Free Solders, Ma, H., Suhling, J. C., Lall, P., Bozack, M. J., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.961-976, May 30-June 2, 2006. 

  16. Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components, Lall, P., Panchagade, D., Iyengar, D., Suhling, J., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.804-816, May 30-June 2, 2006. 

  17. Material Behavior Changes in Underfill Encapsulants Exposed to Isothermal Aging, Lin, C., Islam, S., Suhling, J. C., Lall, P., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.1137-1146, May 30-June 2, 2006. 

  18. Reliability of Flip Chip Assemblies Subjected to Extreme Low Temperatures, Rahim, M. K., Suhling, J. C., Jaeger, R. C., Lall, P., Knight, R., Strickland, M., Blanche, J., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.1379-1389, May 30-June 2, 2006. 

  19. Reliability and Die Stress Measurements in Flip Chip Assemblies with Carbon Fiber Core Laminate Substrates, Copeland, D. S., Rahim, M. K., Suhling, J. C., Jaeger, R. C., Lall, P., Vasoya, K., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.997-1010, May 30-June 2, 2006. 

  20. Degradation of Thermal Performance of Ball Grid Arrays after Thermal Cycling, Knight, R., Elkady, Y., Suhling, J. C., Lall, P., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.833-841, May 30-June 2, 2006. 

  21. Damage Mechanics of Electronics on Metal-Backed Substrates in Harsh Environments, Lall, P., Islam, M. N., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 29, Number 1, pp. 204-212, March 2006. 

  22. Thermal Reliability Considerations for Deployment of Area Array Packages in Harsh Environments, Lall, P., Singh, N., Suhling, J., Strickland, M., Blanche, J., IEEE Transactions on Components and Packaging Technologies, Vol. 28, Number 3, pp. 457-466, September 2005.

  23. Measurement of the Temperature Dependent Constitutive Behavior of Underfill Encapsulants, M. S. Islam, J. Suhling, P. Lall, IEEE Transactions on Components and Packaging Technologies, Vol. 28, Number 3, pp. 467-476, September 2005. 

  24. Die Stress Characterization in Flip Chip on Laminate Assemblies, Rahim, M. K., J. Suhling, D. S. Copeland, M. S. Islam, R. Jaeger, P. Lall, R. W. Johnson, IEEE Transactions on Components and Packaging Technologies, Vol. 28, Number 3, pp. 415-429, September 2005. 

  25. Corner Bonding of CSPs: Processing and Reliability, Tian, G., Liu, Y., Johnson, W., Lall, P., Palmer, M., Islam, M. N., IEEE Transactions on Electronic Packaging Manufacturing, Vol. 28, Number 3, pp. 231-240, July 2005. 

  26. Nano-Underfills for High-Reliability Applications in Extreme Environments, Lall, P., Islam, S., Suhling, J., Tian, G., Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 212 – 222, June 1 – 3, 2005.

  27. Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging, Lall, P., Panchagade, D., Choudhary, P., Suhling, J., Gupte, S., Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 480 – 490, June 1 – 3, 2005.

  28. Prognostication and Health Monitoring of Leaded and Lead Free Electronic and MEMS Packages in Harsh Environments, Lall, P., Islam, N., Suhling, J., Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 1305 – 1313, June 1 – 3, 2005.

  29. Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments, Lall, P., Singh, N., Strickland, M., Blanche, J., Suhling, J., Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 127 – 136, June 1 – 3, 2005.

  30. Fundamentals of Delamination Initiation and Growth in Flip Chip Assemblies, M. K. Rahim, J. C. Suhling, R. C. Jaeger, and P. Lall, Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 1172 – 1186, June 1 – 3, 2005.

  31. Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments, D. S. Copeland, M. K. Rahim, M. S. Islam, J. C. Suhling, R. C. Jaeger, P. Lall, G. Tian, K. Vasoya, Proceedings of the IEEE Aerospace Conference, Big Sky, MT, March 5 – 12, 2005.