Department of Mechanical Engineering

Auburn University

Lall, Pradeep :     Selected Recent Publications


Areas of Interest:

Mechanical Behavior of Materials, Computational Mechanics, Electronic Packaging, Nano-Structures, Reliability, Prognostics, Failure Mechanisms, Life Prediction. 



  1. Prognostics Using Kalman-Filter Models and Metrics for Risk Assessment in BGAs Under Shock and Vibration Loads, Lall, P., Lowe, R., Goebel, K., 60th ECTC, pp. 889-901, Las Vegas, Nevada, June 1-4, 2010.

  2. Assessment of Residual Damage in Lead-free Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling, Lall, P., Vaidya, R., More, V., Goebel, K., Suhling, J., 60th ECTC, pp. 206-218, Las Vegas, Nevada, June 1-4, 2010. .

  3. Self-Organized Mapping of Failure Modes in Portable Electronics Subjected to Drop and Shock, Lall, P., Gupta, P., Panchagade, D., 60th ECTC, pp. 1195-1208, Las Vegas, Nevada, June 1-4, 2010.

  4. Board Trace Fatigue Models and Design Guidelines for Electronics Under Shock-Impact Lall P., Angral, A., Suhling, J., 11th ITHERM, pp. 1-7, Las Vegas, NV, June 2-5, 2010.

  5. Digital-Image Correlation and XFEM Based Shock-Reliability Models for Leadfree and Advanced Interconnects, Lall, P., Kulkarni, M., Angral, A., Panchagade, D., Suhling, J., 60th ECTC, pp. 91-105, Las Vegas, Nevada, June 1-4, 2010.

  6. Peridynamic-Models Using Finite Elements for Shock and Vibration Reliability of Lead-free Electronics Lall, P., Shantaram, S., Panchagade, D., 11th ITHERM, pp. 1-12, Las Vegas, NV, June 2-5, 2010.

  7. Characterization of Microprocessor Chip Stress Distributions During Component Packaging and Thermal Cycling, Roberts, J., Hussain, S., Rahim, M.K., Motalab, M., Suhling, J., Jaeger, R., Lall, P., Zhang, R., 60th ECTC, pp. 1281-1295, Las Vegas, Nevada, June 1-4, 2010.

  8. Reduction of Lead Free Solder Aging Effects using Doped SAC Alloys, Cai, Z., Zhang, Y., Suhling, J., Lall, P., Johnson, R.W., Bozack, M., 60th ECTC, pp. 1493-1511, Las Vegas, Nevada, June 1-4, 2010.

  9. PHM-Based Residual Life Computation of Electronics Subjected to a Combination of Multiple Cyclic-Thermal Environments, Lall, P., Vaidya, R., More, V., Suhling, J., Goebel, K., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  10. Use of Prognostics in Risk-Based Decision Making for BGAs under Shock and Vibration Loads, Lall, P., Lowe, R., Goebel, K., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  11. Fault-Isolation in Portable Electronics Subjected to Drop and Shock, Lall, P., Gupta, P., Panchagade, D., Angral, A., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  12. Thermo-Mechanical Reliability of SAC Leadfree Alloys, Lall, P., Hinshaw, R., Harsha, M., Suhling, J., Pandher, R., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  13. Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads, Lall, P., Choudhary, P., Gupte, S., Hofmeister, J., IEEE TCPT, Vol. 32(3), pp. 600-616, 2009.

  14. Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics, Lall, P., Gupte, S., Choudhary, P., Darveaux, R., IEEE TCPT, Vol. 32(2), pp. 365-377, 2009.

  15. Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads, Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Microelectronics Reliability, Vol. 49(8), pp. 825-838, 2009.

  16. Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments, Lall, P., Islam, N., Choudhary, P., Suhling, J., IEEE TCPT, Vol. 32(1), pp. 135-144, 2009.

  17. Damage Progression Using Speckle-Correlation and High-Speed Imaging for Survivability of Leadfree Packaging Under Shock, Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Strain Journal, Vol. 45(3), pp. 267-282, 2009.

  18. High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics, Lall, P., Panchagade, D., Iyengar, D., Shantaram, S., Schrier, H., IEEE TCPT, Vol. 32(2), pp. 378-395, 2009.

  19. Measurement of Die Stress Distributions in Flip Chip CBGA Packaging, Roberts, J., Hussain, S., Rahim, M.K., Motalab, M., Suhling, J., Jaeger, R., Lall, P., Zhang, R., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  20. The Influence of Aging on the Stress-Strain and Creep Behavior of SAC Solder Alloys, Zhang, Y., Cai, Z., Mustafa, M., Suhling, J., Lall, P., Bozack, M., 11th ITHERM, Las Vegas, NV, June 2-5, 2010.

  21. Feature Vector Based Failure Mode Identification And Prognostication Of Electronics Subjected To Shock And Vibration, Lall, P., Gupta, P., Angral, A., Suhling, J., ASME IMECE, pp. 1-15, Lake Buena Vista, FL, Nov 13-19, 2009.

  22. Prognostication Based On Resistance-Spectroscopy For High Reliability Electronics Under Shock-Impact, Lall, P., Lowe, R., Suhling, J., ASME IMECE, pp. 1-12, Lake Buena Vista, FL, Nov 13-19, 2009.

  23. Leading Indicators Of Damage For Prognostication Of Leadfree Electronics Subjected To Multiple Thermo-Mechanical Environments, Lall, P., Vaidya, R., More, V., Suhling, J., ASME IMECE, pp. 1-13, Lake Buena Vista, FL, Nov 13-19, 2009

  24. Prognostication For Impending Failure In Leadfree Electronics Subjected to Shock and Vibration Using Resistance Spectroscopy, Lall, P., Lowe, R., Suhling, J., 42nd Symposium on Microelectronics (IMAPS), pp. 195-202, CA, Nov 1-5, 2009.

  25. Models For Prediction Of Shock Reliability For Leadfree Area-Array Components In Portable Electronics, Lall, P., Shantaram, S., Angral, A., Kulkarni, M., Suhling, J., AIMS Harsh Environment Electronics Workshop and SMTAI Technical Conference, pp. 55-69, San Diego, CA, Oct 4-8, 2009.

  26. Assessment Of Accrued Thermo-Mechanical Damage In Leadfree Parts During Field-Exposure To Multiple Environments, Lall, P., Vaidya, R., More, V., Suhling, J., AIMS Harsh Environment Electronics Workshop and SMTAI Technical Conference, pp. 907-919, San Diego, CA, Oct 4-8, 2009.

  27. Remaining Useful-Life Based on Damage Pre-Cursors For Leadfree Electronics Subjected to Multiple Thermal-Environments, Lall, P., Vaidya, R., More, V., Suhling, J., ASME InterPACK, San Francisco, CA, USA, pp. 1-13, July 19-23, 2009.

  28. Damage Accumulation And Life-Prediction Models For SnAgCu Leadfree Electronics Under Shock-Impact, Lall, P., Shantaram, S., Angral, A., Kulkarni, M., Suhling, J., ASME InterPACK, San Francisco, CA, USA, pp. 1-15, July 19-23, 2009.

  29. Leading-Indicators Based On Impedance Spectroscopy For Prognostication of Electronics Under Shock And Vibration Loads, Lall, P., Lowe, R., Suhling, J. Goebel, K., ASME InterPACK, San Francisco, CA, USA, pp. 1-12, July 19-23, 2009.

  30. PCR For Derivation of Parameter Dependencies, Thermo-Mechanical Fatigue Constants For Leadfree Electronics, Lall, P., Shirgaokar, A., Arunachalam, D., Suhling, J., Strickland, M., Blanche, J., ASME InterPACK, pp. 1-12, San Francisco, CA, USA, July 19-23, 2009.

  31. Anomaly-Detection And Prognostication Of Electronics Subjected To Shock And Vibration, Lall, P, Gupta, P., Angral, A., Suhling, J., ASME InterPACK, San Francisco, CA, pp. 1-15, July 19-23, 2009.

  32. Evolution Of The Stress-Strain and Creep Behavior Of Underfill Encapsulants With Aging, Lin, C., Suhling, J., Lall, P., ASME InterPACK, pp. 1-17, San Francisco, CA, USA, July 19-23, 2009.

  33. Characterization of Die Stress Distributions in Area Array Flip Chip Packaging, Roberts, J., Rahim, K., Suhling, J., Jaeger, R., Lall, P., Zhang, R., ASME InterPACK, pp. 1-12, San Francisco, CA, USA, July 19-23, 2009.

  34. Cure Profile Effects on The Mechanical Behavior And Reliability of Flip Chip On Laminate Assemblies, Tian, G., Lin, C., Suhling, J., Lall, P., ASME Interpack, pp. 1-8, San Francisco, CA, USA, July 19-23, 2009.

  35. Material Behavior Of Mixed Formulation Solder Joints, Zhang, Y., Kurumaddali, K, Suhling, J., Lall, P., Bozack, M., ASME InterPACK, pp. 1-12, San Francisco, CA, USA, July 19-23, 2009.

  36. Aging Effects On The Mechanical Behavior And Reliability of SAC Alloys, Zhang, Y., Cai, Z., Suhling, J., Lall, P., ASME InterPACK, pp. 1-18, San Francisco, CA, USA, July 19-23, 2009.

  37. Explicit Submodeling and Digital Image Correlation Based Life-Prediction of Leadfree Electronics under Shock-Impact, Lall, P., Shantaran, S., Angral, A., Kulkarni, M., Proceedings of 59th Electronic Components & Technology Conference, San Diego, California, pp. 542-555, May 25-29, 2009.

  38. Fault-Mode Classification for Health Monitoring of Electronics Subjected to Drop and Shock, Lall, P., Gupta, P., Panchagade, D., Angral, A., Proceedings of 59th Electronic Components & Technology Conference, San Diego, California USA, pp. 668-681, May 25-29, 2009.

  39. Principal Component Analysis Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics, Lall, P., Shirgaokar, A., Arunachalam, D.,, Proceedings of 59th Electronic Components & Technology Conference 2009, San Diego, California USA, pp. 251-261, May 25-29, 2009.

  40. Prognostication of Latent Damage and Residual Life in Leadfree Electronics Subjected to Multiple Thermal-Environments, Lall. P., More, V., Vaidya, R., Goebel, K., Proceedings of 59th Electronic Components and Technology Conference, San Diego, California USA, pp. 1381-1392, May 25-29, 2009.

  41. Resistance Spectroscopy-based Condition Monitoring for Prognostication of High Reliability Electronics Under Shock-Impact, Lall. P., Lowe, R., Goebel, K., Proceedings of 59th Electronic Components & Technology Conference, San Diego, California USA, pp. 1245-1255, May 25-29, 2009.

  42. Isothermal Aging Induced Evolution of the Material Behavior of Underfill Encapsulants, Lin, C., Suhling, J., Lall, P., Proceedings of 59th Electronic Components and Technology Conference, San Diego, California USA, pp. 134-149, May 25-29, 2009.

  43. Analysis of the Mechanical Behavior, Microstructure, and Reliability of Mixed Formulation Solder Joints, Zhang, Y., Kurumaddali, K., Suhling, J., Lall, P., Bozack, M., Proceedings of 59th Electronic Components and Technology Conference, San Diego, California USA, pp. 759-770, May 25-29, 2009.

  44. The Effects of SAC Alloy Composition on Aging Resistance and Reliability, Zhang, Y., Cai, Z., Suhling, J., Lall, P., Bozack, M., Proceedings of 59th Electronic Components & Technology Conference, San Diego, California USA, pp. 370-389, May 25-29, 2009.

  45. Prognostics and Condition Monitoring of Electronics, Lall, P., Gupta, P., Panchagade, D., Kulkarni, M., Suhling, J., Hofmeister, J., Proceedings of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanelectronics and Systems, EuroSimE, Delft, Netherlands, pp. 1-14, April 27-29, 2009.

  46. Application of Stress Sensing Test Chips to Area Array Packaging, Suhling, J., Jaeger, R., Lall, P., Rahim, K., Roberts, J., Hussain, S., Proceedings of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanelectronics and Systems (EuroSimE 2009), pp. 1-12, Delft, Netherlands, April 27-29, 2009.

  47. Cohesive-Zone Modeling and Life-Prediction of Leadfree Electronics Under Shock-Impact, Lall, P., Shantaram, S., Angral, A., Kulkarni, M., Proceedings of the 2009 SEM International Congress and Exposition on Experimental and Applied Mechanics, Albuquerque New Mexico USA, pp. 1-18, June 1-4, 2009.

  48. Fault-Detection and Isolation Algorithms for Health Monitoring of Electronics Subjected to Shock and Vibration, Lall, P., Gupta, P., Angral, A., Panchagade, D., Proceedings of the SEM International Congress and Exposition on Experimental and Applied Mechanics, Albuquerque New Mexico USA, pp. 1-19, June 1-4, 2009.

  49. Aging Effects in SAC Solder Joints, Zhang, Y., Cai, Z., Suhling, J., Lall, P., Bozack, M., Proceedings of the SEM International Congress and Exposition on Experimental and Applied Mechanics, Albuquerque New Mexico USA, pp. 1-14, June 1-4, 2009.