R. Wayne Johnson
Director, Information Technology Peak of Excellence
Electrical and Computer Engineering Department
Phone: (334) 844-1880 FAX: (334) 844-1898
Ginn Professor (tenured) - Auburn University, September 15, 2002 - Present.
Director - Information Technology Peak of Excellence, Auburn University, May 16, 2002 - Present.
Alumni Professor (tenured) - Auburn University, September 15, 1997 - September 14, 2002.
Director - NSF Center for Advanced Vehicle Electronics, May, 1999 - May, 2002.
Director - Laboratory for Electronics Assembly and Packaging, September 16, 1987 - Present.
Professor (tenured) - Auburn University, September 15, 1995 - September 14, 1997.
Associate Professor (tenured) - Auburn University, September 15, 1991 - September 14, 1995.
Assistant Professor - Auburn University, September 15, 1987 - September 14, 1991.
Senior Product Engineer - Amperex Electronics Corp., February 15, 1984 - September 14, 1984.
Hybrid Electronics Engineer - Eaton Corporation, January 3, 1983 - February 15, 1984.
Product Specialist - DuPont, Electrical Materials Division, July 1, 1979 - December 31, 1980.
Project Engineer - Microsystems Technology, Inc., May 1977 - April 1979 (part-time).
Dr. Johnson is a Professor of Electrical Engineering at Auburn University and Director of the Information Technology Peak of Excellence. He is responsible for coordinating collaborative research efforts between the NSF Center for Advanced Vehicle Electronics (CAVE), the Center for Innovations in Mobile, Pervasive, and Agile Computing (IMPACT), the Alabama Microelectronics Science and Technology Center (AMSTC) and the Wireless Engineering Research and Education Center (WEREC).
During the past 15 years, he has established teaching and research laboratories at Auburn University for advanced packaging and electronics manufacturing. Research efforts are focused on materials, processing, and reliability for electronics assembly. He has published and presented numerous papers at workshops and conferences and in technical journals. He has also co-edited one IEEE book on MCM technology and written two book chapters in the areas of silicon MCM technology and MCM assembly. He received the 1997 Auburn Alumni Engineering Council Senior Faculty Research Award for his work in electronics packaging and assembly.
Dr. Johnson is the 2003-2004 Technical Vice President of the International Microelectronics and Packaging Society (IMAPS). He was the 1991 President of the International Society for Hybrid Microelectronics (ISHM – the predecessor of IMAPS). He received the 1993 John A. Wagnon, Jr. Technical Achievement Award from ISHM, was named a Fellow of the Society in 1994 and received the Daniel C. Hughes Memorial Award in 1997. He is also a member of IEEE, SMTA, and IPC.
|Dr. R. Wayne Johnson, Resume||Auburn University|
|Information Technology Peak of Excellence||Electrical and Computer Engineering|
|Center for Advanced Vehicle Electronics (CAVE)||Wireless Engineering Education and Research|
|Laboratory for Electronics Assembly and Packaging (LEAP)||Center for Innovations in Mobile, Pervasive, and Agile Computing Technology|
|Alabama Microelectronics Science and Technology Center||International Microelectronics and Packaging Society|