RESEARCH
EXPERTISE
AND INTERESTS
-
functionally
graded materials (FGM)
-
sandwich
structures
-
nanocomposites
-
multifunctional
materials
-
electronic
materials
-
syntactic
foams
-
interpenetrating
phase composites (IPC)
-
interpenetrating
polymer networks (IPN)
RESEARCH
SUMMARY
Dr. Tippur's research broadly deals with (a) failure mechanics
of advanced materials using experimental
and computational methods and (b)
development of optical
sensors. Over the years he has
developed novel techniques based on laser
speckle and geometric moiré methods for mapping three-dimensional
deformations near cracks in ductile materials. He is credited with the
development of a novel real-time optical method called Coherent Gradient Sensing (CGS), suitable for dynamic
fracture studies when used in
conjunction with ultra-high
speed photography. The
method has since found application for characterizing thin film/structures as
well. Dynamic fracture mechanics of polymers, high strength steels and dissimilar material interfaces have been successfully studied using
this new tool. Recently, an infrared
interferometric sensor has been developed to perform rough
surface metrology and flaw detection. The sensor is successfully used for
real-time fracture mechanics studies on plastically deformed ductile
homogeneous materials and bi-material (solder-copper) interfaces. In recent
years they have also successfully extended the method of digital image correlation (DIC) to study fast-fracture events under shock loading conditions using
digital high-speed imaging systems. His current interests include development
and failure characterization of emerging materials such as functionally graded
materials and porous/micro-cellular materials for thermal barrier coatings,
light-weight structures, and surface engineering. Modeling the failure behavior
using finite element method and boundary element method is
integral to many of his research projects. His research is sponsored by
NSF, ARO, NASA and AFoSR. Dr. Tippur
has published over 150 research articles in refereed journals and conference
proceedings.