I am currently
working as a Graduate Research Assistant for the NSF Center
for Advanced Vehicle and Extreme Environment Electronics (
CAVE3
) at Auburn University. The CAVE3,an
NSF Industry and University Cooperative Research program (I/URC),
is a national center of excellence in harsh environment
electronics. The center works with the industry in
developing novel electronic packaging architectures and
manufacturing procedures with special emphasis on harsh
environment and reliability requirements of automotive,
aerospace, military, computing and portable electronics
industries.
As a GRA at CAVE3,
for over two years, I've been working on developing life
prediction models for electronic assemblies subjected to
drop and shock environments. Involved in research projects
funded by the NSF, the Semiconductor Research Corporation
and the member companies of CAVE3, I perform Industry and
MIL standard testing procedures while performing in-situ
deformation measurements on novel packaging architectures
and analyze their failure characteristics in mode and
occurrence. I extensively use Finite Element Modeling
techniques to simulate complex drop/shock and vibration
events. I have published my work on life-prediction models
for electronics in drop and shock in various conference
proceedings such as those of the Electronic Components and
Technology Conference (ECTC), iTHERM, ASME-IMECE and
InterPACK .
Some of the
highlights of my technical skills include:
• Hands on
experience in Scanning Electron Microscopy, JEDEC and
MIL standard Drop & Vibration testing procedures for
electronic assemblies, Data Acquisition systems and
Surface-Mount assembly procedures
• Experience in Design and fabrication of 3D stackable
Package-on-Package test vehicles using novel
surface-mount-assembly techniques tailored for efficient
3D fabrication.
• Characterization of materials with potential
applications in consumer electronic components
• Proficiency in ABAQUS (Standard and Explicit), ANSYS,
HyperMesh, C, C++, MATLAB, Mathematica, LabView and
Solid Edge.