Auburn University
 

Arjun Angral

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Auburn University
 
 

 

I am currently working as a Graduate Research Assistant for the NSF Center for Advanced Vehicle and Extreme Environment Electronics ( CAVE3 ) at Auburn University.  The CAVE3,an NSF Industry and University Cooperative Research program (I/URC), is a national center of excellence in harsh environment electronics. The center works with the industry in developing novel electronic packaging architectures and manufacturing procedures with special emphasis on harsh environment and reliability requirements of automotive, aerospace, military, computing and portable electronics industries.

As a GRA at CAVE
3, for over two years, I've been working on developing life prediction models for electronic assemblies subjected to drop and shock environments. Involved in research projects funded by the NSF, the Semiconductor Research Corporation and the member companies of CAVE3, I perform Industry and MIL standard testing procedures while performing in-situ deformation measurements on novel packaging architectures and analyze their failure characteristics in mode and occurrence. I extensively use Finite Element Modeling techniques to simulate complex drop/shock and vibration events. I have published my work on life-prediction models for electronics in drop and shock in various conference proceedings such as those of the Electronic Components and Technology Conference (ECTC), iTHERM, ASME-IMECE and InterPACK .

Some of the highlights of my technical skills include:

• Hands on experience in Scanning Electron Microscopy, JEDEC and MIL standard Drop & Vibration testing procedures for electronic assemblies, Data Acquisition systems and Surface-Mount assembly procedures
• Experience in Design and fabrication of 3D stackable Package-on-Package test vehicles using novel surface-mount-assembly techniques tailored for efficient 3D fabrication.
• Characterization of materials with potential applications in consumer electronic components
• Proficiency in ABAQUS (Standard and Explicit), ANSYS, HyperMesh, C, C++, MATLAB, Mathematica, LabView and Solid Edge.