S E L E C T
P U B L I C A T I O N S
·
Digital-Image Correlation and XFEM Based Shock-Reliability Models for
Lead-free and Advanced Interconnects, Lall P., Kulkarni M.,
Angral A.,
Panchagade D., Suhling J., Electronic Components and Technology
Conference, 2010. ECTC 2010. 60th, 91-105, 2010.
·
Fault-Isolation in Portable Electronics Subjected to Drop And Shock,
Lall P., Gupta P., Panchagade D.,
Angral A.,
Proceedings of ITHERM 2010, Las Vegas, NV, June 2-5, 2010
·
Board Trace Fatigue Models and Design Guidelines for Electronics Under
Shock-Impact, Lall P.,
Angral A.,
Suhling J., Proceedings of ITHERM 2010, Las Vegas, NV, June 2-5, 2010.
·
Lall, P., Shantaram, S.,
Angral, A.,
Kulkarni, M., "Explicit Submodeling and Digital Image Correlation Based
Life-Prediction of Lead-free Electronics under Shock-Impact," 59th ECTC,
pp. 542-555, San Diego, California USA, May 25-29, 2009.
·
Lall, P., Gupta, P., Panchagade, D.,
Angral, A.,
"Fault-Mode Classification for Health Monitoring of Electronics
Subjected to Drop and Shock," 59th ECTC, pp. 668-681, San Diego,
California USA, May 25-29, 2009.
·
Lall, P., Shantaram, S.,
Angral, A.,
Kulkarni, M., Suhling, J., "Damage Accumulation And Life-Prediction
Models For SnAgCu Leadfree Electronics Under Shock-Impact," ASME
InterPACK, pp. 1-15, San Francisco, CA, USA, July 19-23, 2009.
