Proceedings Paper Submission/Author Instructions

The 2010 IEEE International Power Modulator and High Voltage Conference Proceedings of the papers will be published in a print version and on CD-ROM from your original file of the papers. A technical manuscript is expected for each abstract that has been accepted into the conference technical program. There are tremendous lasting rewards for your paper to be included in the conference proceedings, as they will serve as a permanent record in the literature and be available on IEEE Xplore®.

All manuscripts must be submitted electronically by 5:00 PM, Friday May 21, 2010 and follow the format for IEEE conference papers. A “Sample Manuscript” can be found at the following url:

Manuscript templates are found at

this link 

Contributed oral and poster papers may be up to 4 pages in length, invited oral papers up to 6 pages, and plenary papers up to 8 pages.  

All papers should be submitted as PDF, and they must be IEEE Xplore®-compatible.  Please convert your file into PDF or check the compatibility of your PDF with IEEE PDF eXpress.

Free IEEE compatible PDF converter:

Click on "New User"

Please use Conference ID:  ipmhvc10x  to gain free access to pdf-express.

PDF-express requires you to create an account. 

Paper submission:

To submit your 2010 IPMHVC paper, please use the abstract submission link.

- Enter username/password (same as for the abstract submission)

- Click on "Go to Abstract/Paper Submission"

- A table should appear that has your abstract submission information

- Under Manuscript Options (next to your abstract submission number), click on "Upload"

- Follow the conference paper upload instruction 

Paper submission link: 

Submitted papers will undergo a review as required by IEEE. Authors may be contacted within 3 months after the conference if reviewers suggest changes to the paper. 

If you have any questions regarding the requirements or guidelines, please contact Dr. Enis Tuncer at

Special Issue Announcement  

IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Power Modulators, Repetitive Pulsed Power and High Voltage topics (August 2011). This issue is open to all authors; presenters of papers at the 2010 IEEE International Power Modulator and High Voltage Conference are especially encouraged to submit their work to this special issue.

Manuscript submission deadline: September 30, 2010

Guest Editors: Andreas A. Neuber, Texas Tech University, and

                        Bucur M. Novac, Loughborough University.

First Call: Special TDEI issue.pdf