Published: May 4, 2010 11:00:00 AM
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Zhaozhi Li, doctoral student in Auburn University's Department of Industrial and Systems Engineering, recently earned the best student paper award at the International Conference and Exhibition on Device Packaging for "No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration."
Li's paper focuses on developing a low-cost technique for a 3-D packaging technology. His research is conducted under industrial and systems engineering faculty member John Evans. Also contributing to the research were Sangil Lee and Daniel Baldwin of Georgia Tech, Paul Houston and Brian Lewis from Engent, Inc. and Eugene Stout and Theodore Tessier from FlipChip International. The conference and paper competition was sponsored by the International Microelectronics and Packaging Society.
Contributed by Cassity Hughes