Lall receives senior research award

Published: Apr 16, 2007 3:26:13 PM
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Pradeep Lall, Thomas Walter professor of mechanical engineering in the Samuel Ginn College of Engineering and associate director of the National Science Foundation (NSF) Center for Advanced Vehicle Electronics at Auburn University, has received the 2007 Senior Faculty Engineering Research Award. Lall's research has been sponsored by prestigious federal agencies and industry consortia including the NSF, Semiconductor Research Corporation (SRC), NASA, Naval Air Systems Command and the Army Missile Command.

"Dr. Lall's students benefit immensely from his high level of achievement in research," said David Dyer, department head in mechanical engineering. "They have joined notable blue-chip companies, and their successes after graduation speak to the quality and relevance of the research program that he has built at Auburn."

The award was presented at the Samuel Ginn College of Engineering Faculty-Student Awards and Alumni Recognition Reception held on March 16. The awards seek to recognize and motivate outstanding engineering research achievement by faculty of Auburn University. Faculty, students and alumni may make nominations. Research achievements, their significance and a list of award recognitions represent an important part of the submission.

Lall has ten years of industry experience and has been published extensively in the area of electronic packaging, with emphasis on modeling and predictive techniques. He has authored and co-authored several book chapters, and is the lead author on the book, "Influence of Temperature on Microelectronic and System Reliability," published by CRC Press. He is recipient of three-Motorola Outstanding Innovation Awards, five-Motorola Engineering Awards and four-Publication Awards. Lall holds three U.S. patents and is a Six-Sigma Black-Belt in Statistics. He is an associate editor for the American Society of Mechanical Engineers Journal of Electronic Packaging, Institute of Electrical and Electronics Engineers (IEEE) Transactions on Components and Packaging Technologies and IEEE Transactions on Electronics Packaging Manufacturing.