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Electronics for in-transmission or on-engine
mounting will be exposed to a base plate temperature
of 165°C. Most commercial electronic components,
both active and passive, are not rated above 125°C.
High temperature requirements were
identified in the Semiconductor Industry Association
(SIA) Roadmap as a distinguishing characteristic
of automotive semiconductors.
Critical issues for this development
include substrates, capacitors, integrated circuits,
solder alloys, adhesives and wire bonds. This
extensive project will include a system level
analysis of current designs for limitations at
higher temperatures, identification of thermally
accelerated failure mechanisms and development
of the necessary technology/materials to address
these failure mechanisms. With higher operating
temperatures, the thermal cycle range will also
be extended. Both modeling and experimentation
will be used to find cost effective solutions.
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High Temperature
Electronics Board
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