For higher temperature electronics
applications, ceramic substrates are often used.
Ceramic substrates are not compatible with traditional
through-hole mounted connectors.
The first area of research under
this topic will explore interfacing ceramic substrates
to connectors. SMT connectors do not provide the
ruggedness required and alternate interconnection
methods are being developed and characterized.
A second area of research is active
connectors. Connectors occupy a significant volume
in an electronic assembly. The concept is to incorporate
active devices into the connector increasing the
overall packaging. The thermal performance, reliability
and manufacturing cost of this concept are being
studied.
The third research area is connectors
for applications on-engine or in-transmission.
These applications expose the connector to higher
temperatures (165°C) and significant vibration
levels. Issues to be addressed include pin and
socket base metals and plating finishes, fretting
corrosion, polymers for housings and lubricants.
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