• Woltosz Engineering Research Laboratory: Our laboratory space in the Woltosz Engineering Research Laboratory is primarily used for performing research and development activities. It includes class 10, 100 and 1,000 areas in a Bay & Chase configuration with 4 to 6 inch (100 to 150 mm) wafer processing tools for: Lithography, Deposition/Thermal/Etching and Wet Processing. 
  • Broun Hall:  Our laboratory in Broun Hall is used as our teaching space, as well as for research activities. It includes class 100 and 1000 areas with photolithography and wet processing, as well as flexible space for use in developing new fabrication equipment and processes. 
  • Packaging: Our Packaging lab, also in Broun Hall, includes a surface mount technology line and thick-film processing tools, as well as flip-chip and wirebonding capabilities. This lab also hosts numerous characterization and analysis capabilities including ovens that cover a wide temperature range, environmental test chambers, electrical and mechanical characterization, and cross-section generation and microscopy/imaging capabilities.
  • Cryo and microwave:  Our cryo + microwave lab, located in Broun Hall, includes a substantial set of tools for performing characterization activities and research over a wide range of temperatures (down to 1.2 K) and over a wide range of frequencies (DC to 110 GHz). This lab provides an array of cooling capabilities including dunking into cryogenic liquids (LN2 and LHe) as well as multiple closed-cycle cryogenic systems. Our advanced research systems cryogenic probe station provides chip/component level probing at temperatures down to ~ 15 K. RF and microwave capabilities include both time and frequency domain tools for signal and power integrity characterization of high-speed and dense electronics systems. Equipment details can be found here .
  • Laser:  Our laser lab, located in Broun Hall, is currently under development and will be online very soon. This lab will host unique laser-assisted deposition and fabrication capabilities. Equipment details can be found here .