J. Pazik,
J. Larsen-Basse,
S. Iijima,
K. Dean,
J. M. Kim,
R. Ruoff,
J. Han,
Y.H. Lee,
O. Zhou,
C. Niu,
S. Arepalli,
W.-K. Hsu,
D. Tomanek,
J. L. Margrave,
T. Cagin,
A. Hirata,
B. Spitsyn,
A. Collins,
R. S. Sussmann,
T. Abraham,
K. Kobashi,
J. C.-M. Sung,
J.C. Angus,
A. Fujishima,
L. Schaefer,
E. Kohn,
J. L. Davidson,
T. Shibata,
Z. Sitar,
R. J. Nemanich,
L. Ley,
O. Lemmer,
M. Murakawa,
M. Uemura,
T. Mollart,
M. Whitfield,
C. Wild,
K.Y. Eun,
F. Lu,
D. Paulmier,
S.T. Lee,
Y. Vohra,
J. Butler,
M. Yoshikawa,
Y. Koga,
A. Tanaka,
K. Kobashi,
S. Matsumoto,
T. Ohashi,
C. Ronning,
J. R. Williams,
D. McKenzie,
G.A.J. Amaratunga,
A. Grill,
R. L. C. Wu,
A. Erdemir,
J. Sanders,
T. Yamamoto,
H. Osaki,
T. Nakahigashi,
N. Ohtake,
J. Vlcek,
|
|
Office of Naval Research
Natl. Sci. Found., USA
NEC & Meijyo Univ., Japan
Motorola, USA
Samsung AIT, Korea
Northwestern University, USA
NASA Ames, USA
Jeonbuk Natl U., Korea
U. of North Carolina, USA
Hyperion Catalysis Intl., USA
NASA Johnson Space Center, USA
University of Sussex, UK
Michigan State U., USA
Rice University, USA
Cal. Ins. Tech., USA
Tokyo Inst. of Tech., Japan
Inst. of Phys. Chem., Russia
King's College London, UK
King's College London, UK
Business Communications Co., USA
Kobe Steel and JFCC, Japan
Kinik, Taiwan
Case Western Reserve U., USA
U. of Tokyo, Japan
Fraunhofer IST, Germany
U. of Ulm, Germany
U. of Vanderbilt, USA
Hokkaido University, Japan
North Carolina State U., USA
North Carolina State U., USA
U. of Erlangen, Germany
CemeCon, Germany
NIT, Japan
Toyohashi U.Tech., Japan
DERA, UK
Exitech, UK
FIAF, Germany
KIST, Korea
UST Beijing, China
ERMES Lab., France
City U. Hong Kong, China
U. of Alabama at B'ham, USA
Naval Research Lab., USA
FCT, JFCC, Japan
NIMC, Japan
AIST, MITI, Japan
JFCC, Japan
NIRIM, Japan
Mitsubishi Materials, Japan
U. Gottingen, Germany
Auburn University, USA
U. of Sydney, Australia
U.of Cambridge, UK
IBM, USA
K Systems, USA
Argonne Natl. Lab., USA
Air Force WPB, USA
Fujitsu, Japan
Sony Corp., Japan
Nippon ITF Inc., Japan
TIT, Japan
U. W. Bohemia, Czech Republic
|
Carbon Nanotube At ONR
Nanomaterials, Design & Applications
Carbon Nanotubes
Large-area Electron Emitters
Fully Functional Color CNT FPD
Nano-Manipulation & Applications
CNT for NASA Applications
Capacitors and CNT Applications
Practical CNT Applications
CNT Production and Applications
CNT Composites
Novel Routes to Synthesizing CNT
Hybrid CNT and Properties
Fluoro- & Functionalized CNT
Computational Carbon Tech & Appl
Carbon Onions as Lubricant
Origin and Evolution of CVD Diamond
Annealing of Diamond
New Diamond Market
Diamond And DLC Market
CVD Diamond R&D at Kobe Steel
CVD Diamond Products of Kinik
Electrochemistry & Applications
Microstructures and Electrodes
Diamond Electrochemistry
MEMS and Surgical Knifes
Sensors and Electron Emitters
Micro-machining and MEMS
Silicon on Diamond Technology
Diamond Electron Emitters
Electron Emission from Diamond
Diamond Tools
Diamond Machine Tools
Catalysis & Wear of Diamond
Far IR Diamond Optics
Deep UV Lithography
New MW CVD Reactor & Optics
DC Plasma Diamond Thick Films
Arc Jet Diamond & Machine Tools
Flame CVD & Applications
Ions & Heterogeneous Nucleation
Homoepitaxial Diamond
Diamond Surfaces
Frontier Carbon Technology (FCT)
FCT Novel Materials Synthesis
FCT Mechanical Applications
FCT Electronics Applications
Arc Jet Polycrystalline cBN
cBN Compacts without Additives
PVD cBN & Applications
SiC MOSFET
Cathodic Arc & A-C Materials
Doped a-Carbon for Electronics
DLC:SiO2 as Low-k Dielectrics
DLC & Pulsed Power
a-C & Tribological Applications
DLC Based Solid Lubricant
FCA a-C for Magnetic Media
DLC for Digital Recordings
Flexible DLC Films
BCN and DLC Coatings
Carbon Nitride
|