Diamond MEMS – From Proof-of-Concept to Application

 

 

E. Kohn, M. Adamschik, P. Schmid, S. Ertl*

Dept. of Electron Devices and Circuits

University of Ulm

Ulm, Germany

* present address: GFD, 89081 Ulm, Germany

 

 

Abstract

 

At the European 1998 Diamond conference we had first discussed Diamond MEMS based on HOD films on silicon as an emerging technology. Key elements for electro-mechanical as well as electro-thermal applications were discussed, namely membrane and cantilever structures and a diamond inkjet element.

 

Meanwhile several demonstrators have found their way into specific applications and the structures have been optimized and their static and dynamic performance characterized and compared to that of conventional microsystems technologies.

 

Three of these applications will be discussed:

-          the CVD diamond scalpel used in surgery, the technology of which has been extended to a temperature controlled heated blade,

-          the diamond micro switch, which has been the basis for the devlopment of a microwave power switch, which will be integrated into a coplanar waveguide, and

-          a diamond inkjet, which has been adopted to a piko-litre dispenser system for biochemical processes like the DNA synthesis.

 

These examples show, that diamond is indeed an exceptional MEMS material for extreme conditions. However, in most cases such extreme conditions are not required and the advantages are not obvious. Thus, it has often been questioned whether diamond can be an enabling material. On the other hand, its wide bandgap electronic properties allow to use this material simultaneously in a variety of different active and passive functions. This multi-functionality simplifies the fabrication technology essentially and improves performance and reliability at the same time.

 

Thus, initial windows can be found, where diamond based micro-devices exhibit distinct advantages over devices using conventional materials. Due to improved substrate quality manufacturability is not in question anymore. The next step on the road map will be the integration with Si-based electronics to expand the present device technology to a systems technology.